MT18VDDF12872HG-40BF1 Micron Technology Inc, MT18VDDF12872HG-40BF1 Datasheet - Page 4

• Manufacturer Part Number: MT18VDDF12872HG-40BF1
• Description: MODULE DDR SDRAM 1GB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDF12872HG-40BF1

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 400MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 72b
• Organization: 128Mx72
• Total Density: 1GByte
• Chip Density: 512Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 2.6V
• Operating Current: 1.8A
• Number Of Elements: 18
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.5V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 5:
Pin numbers may not correlate with symbols; refer to Pin Assignment Tables on page 3 for more information
pdf: 09005aef80e4880c, source: 09005aef80e487d7
DDAF18C128x72HG.fm - Rev. A 10/04 EN
107, 108, 109, 110, 111, 112,
71, 72, 73, 74, 79, 80, 83, 84
12, 26, 48, 62, 78, 134, 148,
11, 25, 47, 61, 77, 133, 147,
99, 100, 101, 102, 105,106,
35, 37, 89, 91, 158, 160
PIN NUMBERS
118, 119, 120
121, 122
116, 117
170, 184
169, 183
95, 96
115
Pin Descriptions
DQS0–DQS8
CKE0, CKE1
CAS#,RAS#
CK0, CK0#,
CK1, CK1#,
DM0–DM8
CK2, CK2#
SYMBOL
BA0, BA1
CB0–CB7
S0#, S1#
A0
WE#,
–
A12
Output
Output
Input/
Input/
TYPE
Input
Input
Input
Input
Input
Input
Input
Command Inputs: RAS#, CAS#, and WE# (along with S#) define
the command being entered.
Clock: CK, CK# are differential clock inputs. All address and
control input signals are sampled on the crossing of the
positive edge of CK, and negative edge of CK#. Output data
(DQs and DQS) is referenced to the crossings of CK and CK#.
Clock Enable: CKE HIGH activates and CKE LOW deactivates the
internal clock, input buffers and output drivers. Taking CKE
LOW provides PRECHARGE POWER-DOWN and SELF REFRESH
operations (all device banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any device bank). CKE is synchronous for
POWER-DOWN entry and exit, and for SELF REFRESH entry. CKE
is asynchronous for SELF REFRESH exit and for disabling the
outputs. CKE must be maintained HIGH throughout read and
write accesses. Input buffers (excluding CK, CK# and CKE) are
disabled during POWER-DOWN. Input buffers (excluding CKE)
are disabled during SELF REFRESH. CKE is an SSTL_2 input but
will detect an LVCMOS LOW level after V
CKE is first brought HIGH. After CKE is brought HIGH, it
becomes an SSTL_2 input only.
Chip Selects: S# enables (registered LOW) and disables
(registered HIGH) the command decoder. All commands are
masked when S# is registered HIGH. S# is considered part of
the command code.
Bank Address: BA0 and BA1 define to which device bank an
ACTIVE, READ, WRITE, or PRECHARGE command is being
applied.
Address Inputs: Provide the row address for ACTIVE commands,
and the column address and auto precharge bit (A10) for
READ/WRITE commands, to select one location out of the
memory array in the respective device bank. A10 sampled
during a PRECHARGE command determines whether the
PRECHARGE applies to one device bank (A10 LOW, device bank
selected by BA0, BA1) or all device banks (A10 HIGH). The
address inputs also provide the op-code during a MODE
REGISTER SET command. BA0 and BA1 define which mode
register (mode register or extended mode register) is loaded
during the LOAD MODE REGISTER command.
Data Write Mask. DM LOW allows WRITE operation. DM HIGH
blocks WRITE operation. DM lines do not affect READ
operation.
Data Strobe: Output with READ data, input with WRITE data.
DQS is edge-aligned with READ data, centered in WRITE data.
Used to capture data.
Check Bits.
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1GB (x72, ECC, DR) PC3200
200-PIN DDR SODIMM
DESCRIPTION
DD
is applied and until
©2004 Micron Technology, Inc.