MT8LSDT3264HG-13ED2 Micron Technology Inc, MT8LSDT3264HG-13ED2 Datasheet - Page 9

• Manufacturer Part Number: MT8LSDT3264HG-13ED2
• Description: MODULE SDRAM 256MB 144SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT8LSDT3264HG-13ED2

• Memory Type: SDRAM
• Memory Size: 256MB
• Speed: 133MHz
• Package / Case: 144-SODIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 144SODIMM
• Device Core Size: 64b
• Organization: 32Mx64
• Total Density: 256MByte
• Chip Density: 256Mb
• Access Time (max): 5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 548mA
• Number Of Elements: 8
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 144
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

because unknown operation or incompatibility with
future versions may result.
Write Burst Mode
M2 applies to both READ and WRITE bursts; when
M9 = 1, the programmed burst length applies to READ
bursts, but write accesses are single-location (non-
burst) accesses.
09005aef8077d63a
SD8C8_16_32x64HG.fm - Rev. C 6/04 EN
Test modes and reserved states should not be used,
When M9 = 0, the burst length programmed via M0-
9
Table 8:
64MB, 128MB, 256MB (x64, DR)
SPEED
-13E
-133
-10E
Micron Technology, Inc., reserves the right to change products or specifications without notice.
144-PIN SDRAM SODIMM
CAS LATENCY = 2
CAS Latency Table
CLOCK FREQUENCY (MHz)
ALLOWABLE OPERATING
133
100
100
©2004 Micron Technology, Inc. All rights reserved.
CAS LATENCY = 3
NA
143
133