HCPL-4100#500 Avago Technologies US Inc., HCPL-4100#500 Datasheet - Page 3

• Manufacturer Part Number: HCPL-4100#500
• Description: OPTOCOUPLER 20MA LOOP 8-SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Transmitterr

Specifications of HCPL-4100#500

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Input Type: DC
• Voltage - Supply: 4.5 V ~ 20 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Logic Gate Type: Inverter
• Maximum Baud Rate: 20 KBps
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Output Type: Open Collector
• Maximum Propagation Delay Time: 1.6 us
• Maximum Continuous Output Current: 30 mA
• Maximum Power Dissipation: 360 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Number Of Elements: 1
• Baud Rate: 20Kbps
• Output Current: 30mA
• Package Type: PDIP SMD
• Operating Temp Range: 0C to 70C
• Power Dissipation: 360mW
• Propagation Delay Time: 1600ns
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100)
Solder Reflow Thermal Profile
Figure 1. Solder Reflow Thermal Profile.
3
TEMPERATURE
ROOM
(0.043 ± 0.013)
1.080 ± 0.320
300
200
100
0
Note: Non-halide flux should be used.
0
(0.047)
MAX.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
1.19
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
160°C
150°C
140°C
1
8
(0.100)
BSC
50
2.54
(0.380 ± 0.010)
3°C + 1°C/–0.5°C
9.65 ± 0.25
7
2
PREHEATING TIME
150°C, 90 + 30 SEC.
6
3
2.5°C ± 0.5°C/SEC.
100
4
5
TIME (SECONDS)
(0.070)
1.780
MAX.
(0.140 ± 0.005)
(0.250 ± 0.010)
3.56 ± 0.13
6.350 ± 0.25
TEMP.
PEAK
245°C
(0.025 ± 0.005)
150
0.635 ± 0.130
SEC.
SEC.
30
30
LAND PATTERN RECOMMENDATION
50 SEC.
SOLDERING
200°C
TIME
200
1.27 (0.050)
PEAK
TEMP.
240°C
(0.380 ± 0.010)
(0.300 ± 0.010)
(0.025 ± 0.010)
0.635 ± 0.25
9.65 ± 0.25
7.62 ± 0.25
1.016 (0.040)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
12° NOM.
(0.010
0.254
2.0 (0.080)
10.9 (0.430)
+ 0.003)
- 0.002)
+ 0.076
- 0.051