HCPL-2611-300E Avago Technologies US Inc., HCPL-2611-300E Datasheet - Page 7

OPTOCOUPLER 1CH 10MBD 8-SMD GW

HCPL-2611-300E

Manufacturer Part Number
HCPL-2611-300E
Description
OPTOCOUPLER 1CH 10MBD 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-2611-300E

Isolation Voltage
3750 Vrms
Maximum Fall Time
0.01 us
Minimum Forward Diode Voltage
1.4 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
1.75 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
85 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Package / Case
DIP-8 Gull Wing
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
7V
Opto Case Style
SMD
No. Of Pins
8
Common Mode Ratio
10000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-2611-300E
Manufacturer:
AVAGO
Quantity:
10 000
Part Number:
HCPL-2611-300E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250

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