TDA8350Q/N6,112 NXP Semiconductors, TDA8350Q/N6,112 Datasheet - Page 11

• Manufacturer Part Number: TDA8350Q/N6,112
• Description: IC DC COUPLED V-DEFL 13-SIL
• Manufacturer: NXP Semiconductors

Specifications of TDA8350Q/N6,112

• Applications: *
• Mounting Type: Through Hole
• Package / Case: 13-SIL (Bent and Staggered Leads)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935262194112; TDA8350QU; TDA8350QU

Philips Semiconductors
PACKAGE OUTLINE
January 1995
handbook, full pagewidth
DC-coupled vertical deflection and
East-West output circuit
Dimensions in mm.
12.4
11.6
13
11
3.4
3.1
Fig.6 Plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm); (DBS13P; SOT141-6).
2.20
1.45
13
0.05 convex
12
11
0.75
0.60
10
9
8
(13x)
0.25 M
24.4
23.6
20.0
19.6
10
7
6
5
4
3.4
11
3
2
(12x)
1.7
1
6
mounting
base
2.4
1.6
5.08
0.55
0.35
Preliminary specification
TDA8350Q
4.7
4.1
4.3
(13x)
0.8 M
2.1
1.8
MBC369
A
A
17.0
15.5