BGF 104C E6327 Infineon Technologies, BGF 104C E6327 Datasheet
BGF 104C E6327
Specifications of BGF 104C E6327
BGF 104 E6327
BGF104C E6327
BGF104E6327XT
Related parts for BGF 104C E6327
BGF 104C E6327 Summary of contents
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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BGF104 Revision History: 2006-10-17, V2.1 Previous Version: 2006-03-03 Page Subjects (major changes since last revision) All Layout conformation Data Sheet 3 BGF104 V2.1, 2006-10-17 ...
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HSMMC Interface Filter and ESD Protection Feature • ESD protection and filter for High Speed Multi Media Card interface • ESD protection the external IOs • 16 pin green wafer level package with SnAgCu solder ...
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Table 1 Maximum Ratings Parameter Voltage at all pins to GND Operating temperature range Storage temperature range Electrostatic Discharge According to IEC61000-4-2 Ext.IOs: A1, A2, A3, B1, B2, C1, D1 Int. IOs: A4, B4; C3, C4, D3, D4 Table 2 ...
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Pin imension is measured at the maximum solder ball diameter, parallel to primary datum C 2) Pin A1 corner identified by marking 3) Primary datum C and seating plane are defined by the spherical crowns of ...