PIP250M,518 NXP Semiconductors, PIP250M,518 Datasheet - Page 14

• Manufacturer Part Number: PIP250M,518
• Description: IC CONV DC/DC BUCK 68-HVQFN
• Manufacturer: NXP Semiconductors
• Type: Step-Down (Buck)r

Specifications of PIP250M,518

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: Adj to 0.8V
• Current - Output: 15A
• Frequency - Switching: 300kHz
• Voltage - Input: 5V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Power - Output: 3.6W
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 568-2329-2; 934057515518; PIP250M /T3

Philips Semiconductors
14. Soldering
9397 750 10904
Product data
Fig 13. Typical reflow soldering process flow.
POST REFLOW INSPECTION
14.1 Introduction to soldering HVQFN packages
REFLOW SOLDERING
(PREFERABLY X-RAY)
SOLDER PASTE
REWORK AND
COMPONENT
PRE REFLOW
INSPECTION
INSPECTION
POST PRINT
PLACEMENT
TOUCH UP
PRINTING
The HVQFN package is a near Chip Scale Package (CSP) with a copper lead frame.
It is a leadless package, where electrical contact to the printed circuit board is made
through metal pads on the underside of the package. In addition to the small pads
around the periphery of the package, there are large pads on the underside that
provide low thermal resistance, low electrical resistance, low inductance connections
between the power components inside the package and the PCB. It is this feature of
the HVQFN package that makes it ideally suited for low voltage, high current DC to
DC converter applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reflowing the solder in a convection or infra-red oven. The solder reflow process is
shown in
ensure good solder joints, the peak temperature T
the time above liquidus temperature should be less than 1.25 minutes. The ramp rate
during preheat should not exceed 3 K/s. Nitrogen purge is recommended during
reflow.
03aj25
Figure 13
Rev. 02 — 21 February 2003
and the typical temperature profile is shown in
Fig 14. Typical reflow soldering temperature profile.
Temp
( C)
300
200
100
T p
T r
T e
0
0
rate of rise of
temperature < 3 K/s
1 min max
p
should not exceed 220 C, and
1
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Integrated buck converter
1.25 min max
2
PIP250M
Figure
time (minutes)
14. To
03aj26
3
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