B32912A3223M EPCOS Inc, B32912A3223M Datasheet - Page 6

• Manufacturer Part Number: B32912A3223M
• Description: CAP FILM .022UF 330VAC SUPPRESS
• Manufacturer: EPCOS Inc
• Series: MKP B32912r

Specifications of B32912A3223M

• Capacitance: 0.022µF
• Voltage - Ac: 330V
• Voltage - Dc: 760V
• Dielectric Material: Polypropylene, Metallized
• Tolerance: ±20%
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 0.709" L x 0.197" W (18.00mm x 5.00mm)
• Height: 0.413" (10.50mm)
• Termination: PC Pins
• Lead Spacing: 0.591" (15.00mm)
• Features: EMI Suppression
• Capacitor Dielectric Type: Polypropylene
• Capacitance Tolerance: ± 20%
• Voltage Rating: 330VAC
• Capacitor Case Style: Radial
• No. Of Pins: 2
• Capacitor Mounting: Through Hole
• Lead: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 495-3239; B32912A3223M000

Mounting guidelines
1
1.1
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
1.2
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
MKT boxed (except 2.5
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5
MKP
MKT
Please read Cautions and warnings and
Important notes at the end of this document.
coated
uncoated (lead spacing > 10 mm)
(lead spacing
uncoated (lead spacing
insulated (B32559)
Soldering
Solderability of leads
Resistance to soldering heat
B32911 ... B32916
X1 / 330 V AC
7.5 mm)
6.5
6.5
7.2 mm)
235 5 C
2.0 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
10 mm)
7.2 mm)
Solder bath temperature Soldering time
260 5 C
Page 6 of 16
10 1 s
5 1 s
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing
insulated (B32559)
10 mm) and