B32912A3223M EPCOS Inc, B32912A3223M Datasheet - Page 10

CAP FILM .022UF 330VAC SUPPRESS

B32912A3223M

Manufacturer Part Number
B32912A3223M
Description
CAP FILM .022UF 330VAC SUPPRESS
Manufacturer
EPCOS Inc
Series
MKP B32912r
Datasheet

Specifications of B32912A3223M

Capacitance
0.022µF
Voltage - Ac
330V
Voltage - Dc
760V
Dielectric Material
Polypropylene, Metallized
Tolerance
±20%
Operating Temperature
-40°C ~ 110°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
0.709" L x 0.197" W (18.00mm x 5.00mm)
Height
0.413" (10.50mm)
Termination
PC Pins
Lead Spacing
0.591" (15.00mm)
Features
EMI Suppression
Capacitor Dielectric Type
Polypropylene
Capacitance Tolerance
± 20%
Voltage Rating
330VAC
Capacitor Case Style
Radial
No. Of Pins
2
Capacitor Mounting
Through Hole
Lead
RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-3239
B32912A3223M000

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B32912A3223M000
Manufacturer:
BOURNS
Quantity:
30 000
Part Number:
B32912A3223M189
Manufacturer:
TDK-EPCOS
Quantity:
30 000
Part Number:
B32912A3223M289
Manufacturer:
TDK-EPCOS
Quantity:
30 000
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32911 ... B32916
X1 / 330 V AC
Page 10 of 16

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