BD9850FVM-TR Rohm Semiconductor, BD9850FVM-TR Datasheet - Page 15

• Manufacturer Part Number: BD9850FVM-TR
• Description: IC REG SW STEP DOWN HI EFF 8MSOP
• Manufacturer: Rohm Semiconductor
• Type: Step-Down (Buck)r
• Series: -r

Specifications of BD9850FVM-TR

• Internal Switch(s): No
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Current - Output: 200mA
• Frequency - Switching: 100kHz ~ 2MHz
• Voltage - Input: 4 ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Power - Output: 587mW
• Mounting Style: SMD/SMT
• Pwm Type: Controller
• Frequency - Max: 2MHz
• Duty Cycle: -
• Voltage - Supply: 4 V ~ 9 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MSOP8
HTSSOP-B20
<Dimension>
<Dimension>
11)
12)
Thermal derating characteristics
Selection of order type
Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit
characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static
and transient characteristics for external components as well as this Rohm IC. Allow for sufficient margins when determining circuit constants.
Oscillation frequency setting resistor
For the oscillation frequency setting resistor to be inserted between the RT pin and the GND pin, mount this resistor close to the RT pin and
provide the shortest pattern routing.
0.475
0.325
2.9 ± 0.1
0.65
20
1
PD(W)
0.65
8
1
6.5 ± 0.1
0.8
0.6
0.4
0.2
5
4
ROHM
model name
0
0.22
B
0
0.2
0.08 S
MSOP 8
(1) : Single piece of IC
(2) : With ROHM standard PCB mounted
(2) 0.59 W
(1) 0.30 W
Wiring width 0.4mm
Pd = 0.50 W
qjc = 200˚C/W
11
+0.05
–0.04
10
+0.05
+0.04
AMBIENT TEMPERATURE : Ta [˚C]
(Glass epoxy PCB of 70mmX70mmX1.6mm)
25
D
0.145
0.08
S
0.08
0.17
+0.05
–0.03
S
50
+0.05
+0.03
M
Fig.30
9
75
Product No.
9850=10V
9851=20V
(unit : mm)
(unit : mm)
8
100
5
125
0
150
<Package specifications>
<Package specifications>
Package type
FVM=MSOP8
EFV=HTSSOP-B20
Package style
Quantity
Packaging
direction
Package style
Quantity
Packaging
direction
F
15/16
V
PD(W)
M
Reel
Reel
5
4
3
2
1
0
0
HTSSOP-B20
(1) : Single piece of IC
(2) : 2-layer PCB (Copper foil area on the reverse side of PCB: 15mmX15mm
(3) : 2-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm
(4) : 4-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm
(4) 3.20W
(3) 2.30W
(2) 1.45W
(1) 1.00W
PCB size: 70mm X70mmX1.6 mm
Copper foil area on the reverse side of PCB: 10.5X10.5mm
AMBIENT TEMPERATURE : Ta [˚C]
25
Embossed carrier tape
3000 pieces /reel
TR
(When holding a reel in left hand and pulling out the tape with
right hand, No. 1 pin appears in the upper right of the reel.)
Embossed carrier tape (Moisture-proof specificatin)
2500 pieces /reel
E2
(When holding a reel in left hand and pulling out the tape with
right hand, No. 1 pin appears in the upper left of the reel.)
Taping type
TR=Reel-type embossed carrier tape (MSOP8)
E2=Reel-type embossed carrier tape (HTSSOP-B20)
50
T
R
No. 1 pin
75
Fig.31
2 (
PCB incorporates thermal via)
No. 1 pin
100
125
2
150
Pulling-out side
Pulling-out side