MAX1820XEUB+T Maxim Integrated Products, MAX1820XEUB+T Datasheet - Page 2

• Manufacturer Part Number: MAX1820XEUB+T
• Description: IC REG BUCK WCDMA 10-MSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX1820XEUB+T

• Applications: Converter, WCDMA Power Amplifier Applications
• Voltage - Input: 2.6 ~ 5.5 V
• Number Of Outputs: 1
• Voltage - Output: 0.4 ~ 3.4 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
BATT, OUT (FB), SHDN, SYNC, SKIP,
PGND to GND .......................................................-0.3V to +0.3V
LX, COMP to GND...................................-0.3V to (V
Output Short-Circuit Duration ............................................Infinite
Continuous Power Dissipation (T
WCDMA Cellular Phone 600mA
Buck Regulators
ELECTRICAL CHARACTERISTICS
(V
Typical values are at T
Note 1: For UCSP solder profile information, visit www.maxim-ic.com/1st_pages/UCSP.htm.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Input BATT Voltage
Undervoltage Lockout
Threshold
Quiescent Current
Quiescent Current in Dropout
Shutdown Supply Current
ERROR AMPLIFIER
OUT Voltage Accuracy
(MAX1820)
OUT Input Resistance
(MAX1820)
REF Input Current (MAX1820)
FB Voltage Accuracy
(MAX1821)
FB Input Current (MAX1821)
Transconductance
COMP Clamp Low Voltage
COMP Clamp High Voltage
BATT
REF to GND .......................................................-0.3V to +6.0V
3
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
✕
_______________________________________________________________________________________
4 UCSP (derate 10.4mW/°C above +70°C)............832mW
= 3.6V, SHDN = BATT, SKIP = SYNC = GND, V
PARAMETER
A
= +25°C.) (Note 2)
A
= +70°C)
SYMBOL
V
I
V
R
SHDN
I
UVLO
V
V
REF
I
g
OUT
OUT
I
FB
Q
FB
IN
m
V
SKIP = GND (MAX1820Z/MAX1821)
SKIP = BATT, no switching
SKIP = GND (MAX1820Y, MAX1820X, and
MAX1821X)
SKIP = BATT, 1MHz switching
SKIP = GND
SKIP = BATT, no switching
SHDN = GND
V
SKIP = BATT or GND
V
SKIP = BATT, V
FB = COMP
V
BATT
BATT
REF
REF
FB
= 1.4V
= 1.932 0.005V, load = 0 to 600mA,
= 0.227 0.005V, load = 0 to 30mA,
+ 0.3V)
rising, 1% hysteresis
REF
= 1.25V (MAX1820 only), T
CONDITIONS
BATT
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Ranges
Solder Profile (UCSP) ......................................................(Note 1)
Lead Temperature (soldering, 10s) .................................+300°C
3
10-Pin µMAX ..................................................-65°C to +150°C
4.2V
✕
4 UCSP ....................................................-40°C to +150°C
A
= 0°C to +85°C, unless otherwise noted.
1.225
MIN
2.20
3.33
0.35
2.04
250
2.6
0.2
30
3300
TYP
2.35
0.40
1.25
0.01
0.45
2.15
180
450
240
530
550
400
0.1
3.4
0.1
50
1.275
MAX
2000
1000
1000
2.55
3.47
0.45
2.28
300
360
5.5
1.0
50
85
6
1
UNITS
k
µA
µA
µA
µA
nA
µS
V
V
V
V
V
V