IR3624MTRPBF International Rectifier, IR3624MTRPBF Datasheet - Page 17

• Manufacturer Part Number: IR3624MTRPBF
• Description: IC CTRLR PWM SYNC BUCK 10-MLPD
• Manufacturer: International Rectifier

Specifications of IR3624MTRPBF

• Package / Case: 10-MLPD
• Voltage - Supply: 4.5 V ~ 14 V
• Frequency-max: 660kHz
• Operating Temperature: -40°C ~ 125°C
• Number Of Outputs: 1
• Duty Cycle: 71%
• Pwm Type: Voltage Mode
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Frequency: 600kHz
• Supply Voltage Range: 4.5V To 14V
• Digital Ic Case Style: MLPD
• No. Of Pins: 10
• Operating Temperature Range: -40°C To +125°C
• Termination Type: SMD
• Input Voltage Primary Min: 5V
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Control Mode: Voltage
• Controller Type: PWM
• Package: 10-Lead MLPD
• Circuit: Sync PWM Controller
• Vcc (min): 4.0
• Vcc (max): 14
• Vout (min): 0.6
• Vout (max): Vcc * 0.71
• Iout (a): 10
• Switch Freq (khz): Internal 600kHz
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3624MPBFTR

Programming the Current-Limit
The Current-Limit threshold can be set by
connecting a resistor (R
side MOSFET to the OCSet pin. The resistor
can be calculated by using equation (3).
The
coefficient and it should be considered for the
worse case operation. This resistor must be
placed close to the IC, place a small ceramic
capacitor from this pin to ground for noise
rejection purposes.
Layout Consideration
The layout is very important when designing high
frequency switching converters. Layout will affect
noise pickup and can cause a good design to
perform with less than expected results.
Start to place the power components, make all
the connection in the top layer with wide, copper
filled areas.
I
(50%
R
R
SET
DS
OCSet
I
R
SET
(
DS(on)
on
≅
=
)
I
over
=
o
=
I
(
L
LIM
R
13
(
critical
7
)
.
=
=
has
4
)
nominal
=
6
m
9
K
A
R
Ω
OCSet
Ω
∗
R
∗
a
1
DS
1
.
∗
5
(
.
on
5
SET
I
OCSet
positive
output
)
=
=
9
) from drain of low
20
A
.
1
--(
m
current)
) 3
Ω
temperature
The inductor, output capacitor and the MOSFET
should be close to each other as possible. This
helps to reduce the EMI radiated by the power
traces due to the high switching currents through
them. Place input capacitor directly to the drain of
the high-side MOSFET, to reduce the ESR
replace the single input capacitor with two
parallel units.
The feedback part of the system should be kept
away from the inductor and other noise sources.
The
capacitors for Vcc and Vc should be close to
respective pins. It is important to place the
feedback components include feedback resistors
and compensation components close to Fb and
Comp pins.
In multilayer PCB use one layer as power ground
plane and have a control circuit ground (analog
ground), to which all signals are referenced. The
goal is to localize the high current path to a
separate loop that does not interfere with the
more sensitive analog control function. These two
grounds must be connected together on the PC
board layout at a single point.
The MLPD is thermal enhanced package, based
on thermal performance it is recommended to
use 4-layers PCB. To effectively remove heat
from the device the exposed pad should be
connected to ground plane using vias.
critical
bypass
components
IR3624MPBF
such
as
17