STTS424BDN3F STMicroelectronics, STTS424BDN3F Datasheet - Page 34

• Manufacturer Part Number: STTS424BDN3F
• Description: IC MEMORY MOD TEMP SENSOR 8-TDFN
• Manufacturer: STMicroelectronics

Specifications of STTS424BDN3F

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8502-2

Landing pattern
Table 25.
1. Minimum acceptable option to be used when routing prevents preferred width contact.
2. Preferred option to be used when possible.
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Parameter
D2
E2
E3
K2
e2
b2
e4
b4
K
L
e
b
Heat paddle width
Heat paddle height
Heat paddle centerline to contact inner locus
Contact length
Heat paddle to contact keepout
Contact to contact keepout
Contact centerline to contact centerline pitch for inner contacts
Contact width for inner contacts
Landing pattern centerline to outer contact centerline, “minimum
acceptable” option
Corner contact width, “minimum acceptable option”
Landing pattern centerline to outer contact centerline, “preferred” option
Corner contact width, “preferred” option
Table 25
minimum acceptable” based on the JEDEC proposal.
Parameters for landing pattern - TDFN package (DN)
lists variations of landing pattern implementations, ranked as “preferred”, and
(1)
Description
(2)
(1)
(2)
1.00
1.40
1.40
0.70
0.20
0.20
0.25
0.25
0.45
Min
-
-
-
Dimension
Nom
0.50
0.60
0.50
-
-
-
-
-
-
-
-
-
STTS424
Max
1.60
1.60
0.80
0.30
0.30
0.50
-
-
-
-
-
-