SE98TK,118 NXP Semiconductors, SE98TK,118 Datasheet - Page 35

IC TEMP SENSOR I2C 8HVSON

SE98TK,118

Manufacturer Part Number
SE98TK,118
Description
IC TEMP SENSOR I2C 8HVSON
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SE98TK,118

Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
1.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-HVSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3347-2
935281692118
SE98TK-T
NXP Semiconductors
15. Revision history
Table 31.
SE98_4
Product data sheet
Document ID
SE98_4
Modifications:
SE98_3
SE98_2
SE98_1
(9397 750 14649)
Revision history
Release date
20090202
20080404
20080107
20060510
Changed data sheet descriptive title from “SO-DIMM SMBus/I
“DDR memory module temp sensor, 3.3 V”
Section 1 “General
+125 C”
Section 2.2 “Temperature sensor
to “ 40 C to +125 C”
Section 7.3 “EVENT output condition”
Added
Table 7 “Capability register (address 00h) bit
– description of symbol TRES: appended “(11-bit)”
– description of symbol BCAP: changed from “has Alarm and Critical Trips capability” to “has
Table 9 “Configuration register (address 01h) bit
Table 10 “Hysteresis
– added 2 right-most columns “Critical Alarm Window Bit (bit 15)”
– “T
– “T
– “hysteresis” replaced with “T
Section 8.4 “Temperature
Table 25
– changed descriptive line below table title from “T
– symbol T
Table 26 “SMBus DC
“T
Table 27 “SMBus AC
“T
amb
amb
Alarm and Critical Trips interrupt capability”
+125 C”
th(low)
th(high)
= 20 C to +120 C” to “T
= 20 C to +120 C” to “T
Section 7.10 “Hot plugging”
“Characteristics”:
” replaced with “T
” replaced with “T
lim(acc)
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
, condition “T
description”, first sentence: changed from “ 20 C to +125 C” to “ 40 C to
enable”:
characteristics”: changed descriptive line below table title from
characteristics”: changed descriptive line below table title from
Rev. 04 — 2 February 2009
format”: added 4
trip(l)
trip(u)
amb
hys
amb
amb
features”, last bullet item changed from “ 20 C to +125 C”
= 20 C to +125 C” changed to “T
= 40 C to +120 C”
= 40 C to +120 C”
re-written
th
paragraph and
description”:
Change notice
-
-
-
-
description”: description of bit 2, CVO, re-written
DDR memory module temp sensor, 3.3 V
amb
= 20 C to +125 C” to “T
Table 11
2
C-bus temperature sensor” to
Supersedes
SE98_3
SE98_2
SE98_1
-
amb
= 40 C to +125 C”
© NXP B.V. 2009. All rights reserved.
amb
= 40 C to
SE98
35 of 39

Related parts for SE98TK,118