NE1617ADS,112 NXP Semiconductors, NE1617ADS,112 Datasheet - Page 22

• Manufacturer Part Number: NE1617ADS,112
• Description: IC TEMP MONITOR 16SSOP
• Manufacturer: NXP Semiconductors

Specifications of NE1617ADS,112

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Multiplexer, Register Bank
• Sensor Type: External & Internal
• Sensing Temperature: -55°C ~ 125°C, External Sensor
• Output Type: SMBus™
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Temperature Sensor Function: Temp Sensor
• Interface Type: Serial (2-Wire)
• Operating Temperature (min): 0C
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935268119112; NE1617ADS; NE1617ADS

NXP Semiconductors
NE1617A_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 15.
Table 16.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
16
14.
Rev. 04 — 30 July 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
Temperature monitor for microprocessor systems
3
3
)
)
Figure
350 to 2000
260
250
245
14) than a SnPb process, thus
220
220
350
> 2000
260
245
245
NE1617A
© NXP B.V. 2009. All rights reserved.
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