IR3502BMTRPBF International Rectifier, IR3502BMTRPBF Datasheet - Page 37

• Manufacturer Part Number: IR3502BMTRPBF
• Description: IC REG XPH INTEL VR11.1 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3502BMTRPBF

• Package / Case: 32-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 8mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 100°C
• Applications: Processor
• Operating Temperature (max): 150C
• Operating Temperature (min): 0C
• Pin Count: 32
• Mounting: Surface Mount
• Package Type: MLPQ
• Case Length: 5mm
• Screening Level: Commercial
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Switch Freq (khz): 250kHz to 1.5MHz
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stencil Design
 The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
 The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
 The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit
 The maximum length and width of the land pad stencil aperture should be equal to the solder resist
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
approximately 50% area of solder on the center pad. If too much solder is deposited on the center pad
the part will float and the lead lands will be open.
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
Page 37 of 38
IR3502B
V3.2