IR3086AMTRPBF International Rectifier, IR3086AMTRPBF Datasheet - Page 31

• Manufacturer Part Number: IR3086AMTRPBF
• Description: IC CTLR XPHASE 28-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3086AMTRPBF

• Package / Case: 20-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 10mA
• Voltage - Supply: 8.4 V ~ 14 V
• Operating Temperature: 0°C ~ 125°C
• Applications: Processor
• Package: 20-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 2.5A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
• The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is completely
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
• The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder
Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
removed from between the lead lands forming a single opening for each “group” of lead lands.
fillet so a solder resist width of ≥ 0.17mm remains.
copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have
the solder resist opening for the land pad to be smaller than the part pad.
ratio of the solder resist strip separating the lead lands from the pad land.
diameter of the via.
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