L6229D STMicroelectronics, L6229D Datasheet - Page 19

• Manufacturer Part Number: L6229D
• Description: IC MOTOR DRIVER 3PHASE 24-SOIC
• Manufacturer: STMicroelectronics
• Type: Driverr

Specifications of L6229D

• Applications: DC Motor Driver, Brushless (BLDC), 3 Phase
• Number Of Outputs: 1
• Current - Output: 2.8A
• Voltage - Supply: 12 V ~ 52 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Operating Temperature Classification: Automotive
• Package Type: SO
• Operating Supply Voltage (min): 12V
• Operating Supply Voltage (max): 52V
• Operating Supply Voltage: 8 V to 52 V
• Supply Current: 1.4 A
• Mounting Style: SMD/SMT
• Motor Type: Three Phase DC Brushless
• No. Of Outputs: 3
• Output Current: 3.55A
• Output Voltage: 52V
• Supply Voltage Range: 8V To 52V
• Driver Case Style: SO
• No. Of Pins: 24
• Rohs Compliant: Yes
• For Use With: 497-5491 - EVAL BOARD FOR L6229PD SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-5839-5; L6229D

4.1 OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Figure 25 is shown the approximate relation between the output current and the IC power dissipation using
PWM current control.
For a given output current the power dissipated by the IC can be easily evaluated, in order to establish which
package should be used and how large must be the on-board copper dissipating area to guarantee a safe op-
erating junction temperature (125°C maximum).
Figure 25. IC Power Dissipation versus Output Power.
4.2 THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can
be delivered by the device in a safe operating condition. Selecting the appropriate package and heatsinking con-
figuration for the application is required to maintain the IC within the allowed operating temperature range for
the application. Figures 26, 27 and 28 show the Junction-to-Ambient Thermal Resistance values for the
PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5mm copper thickness FR4 board
with 6cm
mounting methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance
can be reduced down to 15°C/W.
Figure 26. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
2
dissipating footprint (copper thickness of 35µm), the R
ºC / W
43
38
33
28
23
18
13
P
D
[W]
1
10
2
8
6
4
2
0
3
0
4
0.25 0.5 0.75
5
6
s q . c m
I
OUT
7
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
8
[A]
9
1
10
1 1
1.25 1.5
1 2
13
Test Condition s:
Supply Voltage = 24 V
I
I
I
1
2
3
th(j-amb)
On-Board Copper Area
No PWM
f
SW
I
= 30 kHz (slow decay)
OUT
is about 35°C/W. Figure 29 shows
I
OUT
I
OUT
L6229
19/25