TDF5140AP/C1,112 NXP Semiconductors, TDF5140AP/C1,112 Datasheet - Page 18
![IC MOTOR DVR BRUSHLESS 18-PDIP](/photos/7/45/74588/18-dip__300mil__sml.jpg)
TDF5140AP/C1,112
Manufacturer Part Number
TDF5140AP/C1,112
Description
IC MOTOR DVR BRUSHLESS 18-PDIP
Manufacturer
NXP Semiconductors
Type
Brushless DC Motor Controllerr
Datasheet
1.TDF5140APC1112.pdf
(19 pages)
Specifications of TDF5140AP/C1,112
Package / Case
18-DIP (0.300", 7.62mm)
Mounting Type
Through Hole
Current - Output
800mA
Voltage - Supply
4 V ~ 18 V
Operating Temperature
-30°C ~ 70°C
Applications
DC Motor Driver, Brushless (BLDC), 3 Phase
Number Of Outputs
1
Supply Current
5 mA
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Load
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935265573112
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDF5140A
SOLDERING
Plastic dual in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for
more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it
must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s.
1999 March 15
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