BD6210F-E2 Rohm Semiconductor, BD6210F-E2 Datasheet - Page 2

• Manufacturer Part Number: BD6210F-E2
• Description: IC H-BRIDGE DVR 7V 1CH .5A 8-SOP
• Manufacturer: Rohm Semiconductor

Specifications of BD6210F-E2

• Applications: DC Motor Driver
• Number Of Outputs: 1
• Current - Output: 500mA
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• No. Of Outputs: 1
• Output Current: 500mA
• Supply Voltage Range: 3V To 5.5V
• Driver Case Style: SOP
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Svhc: No SVHC (18-Jun-2010)
• Package /: RoHS Compliant
• Product: H-Bridge Drivers
• Supply Voltage (max): 7 V
• Supply Voltage (min): 3 V
• Supply Current: 0.7 mA
• Maximum Power Dissipation: 0.687 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Bridge Type: H-bridge
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• Operating Supply Voltage: 3 V to 5.5 V
• Motor Type: H-Bridge
• Rohs Compliant: Yes
• Base Number: 6210
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BD6210F-E2TR

Absolute maximum ratings (Ta=25°C)
Operating conditions (Ta=25°C)
Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=5V)
*** Notes: All voltages are with respect to ground.
*1 BD6210 / BD6215. Do not, exceed Pd or ASO.
*2 BD6211 / BD6216. Do not, exceed Pd or ASO.
*3 BD6212 / BD6217. Do not, exceed Pd or ASO.
*4 SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/°C above 25°C.
*5 SSOPB24 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 7.8mW/°C above 25°C.
*6 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C.
*7 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C.
*8 HSOPM28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/°C above 25°C.
*1 BD6210 / BD6215
*2 BD6211 / BD6216
*3 BD6212 / BD6217
Supply voltage
VREF voltage
Supply current
Stand-by current
Input high voltage
Input low voltage
Input bias current
Output ON resistance *
Output ON resistance *
Output ON resistance *
VREF bias current
Carrier frequency
Input frequency range
Operating temperature
Junction temperature
Storage temperature
All other input pins
Power dissipation
Supply voltage
Output current
Parameter
Parameter
Parameter
1
2
3
Symbol
F
I
I
F
R
R
R
VREF
STBY
I
V
V
PWM
Symbol
Symbol
I
MAX
CC
Tjmax
I
VREF
IH
ON
ON
ON
T
T
VCC
IH
OMAX
IL
VCC
V
Pd
OPR
STG
IN
Min.
-10
0.4
2.0
0.5
0.5
0.2
30
20
20
-
-
Limits
0.687 *
Typ.
0.7
1.0
1.0
0.5
50
25
0
0
2/16
-
-
-
4
/ 0.98 *
Max.
0.5 *
100
100
1.5
0.8
1.5
1.5
1.0
10
10
35
-
-0.3 ~ VCC
-55 ~ +150
1
Conditions
-40 ~ +85
3.0 ~ 5.5
1.5 ~ 5.5
5
Ratings
/ 1.0 *
/ 1.4 *
150
7
Unit
kHz
kHz
mA
µA
µA
µA
Ω
Ω
Ω
V
V
2
6
/ 2.0 *
/ 1.45 *
Forward / Reverse / Brake
Stand-by
V
I
I
I
VREF=VCC
VREF=3.75V
FIN / RIN
3
O
O
O
IN
=0.25A, vertically total
=0.5A, vertically total
=1.0A, vertically total
7
=5.0V
/ 2.2 *
Conditions
8
Unit
Unit
°C
°C
°C
W
V
A
V
V
V