MC33291DW Freescale Semiconductor, MC33291DW Datasheet - Page 4

• Manufacturer Part Number: MC33291DW
• Description: IC SWITCH 8X L-SIDE W/SPI 24SOIC
• Manufacturer: Freescale Semiconductor
• Type: Low Sider

Specifications of MC33291DW

• Input Type: SPI
• Number Of Outputs: 8
• On-state Resistance: 600 mOhm
• Current - Output / Channel: 500mA
• Current - Peak Output: 3A
• Voltage - Supply: 9 V ~ 26.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• For Use With: KIT33291DWEVB - KIT EVAL FOR MC33291 SMART SW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

4
Table 3. Maximum Ratings
permanent damage to the device.
33291
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Notes
Power Supply Voltage
Logic Supply Voltage
Input Pin Voltage
Output Clamp Voltage
Output Self-Limit Current
Continuous Per Output Current
ESD Voltage
Output Clamp Energy
Recommended Frequency of SPI Operation
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Power Dissipation (
Peak Package Reflow Temperature During Reflow
10.
11.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
5.
6.
7.
8.
9.
Normal Operation (Steady-State)
Transient Conditions
5.0 mA
Human Body Model
Machine Model
Transient capability with external 100
Exceeding these limits may cause a malfunction or permanent damage to the device.
Exceeding the limits on SCLK, SI,
With output OFF.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125 C ambient temperature
will require maximum output current computation using package R
ESD data available upon request.
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
Maximum output clamp energy capability at 150 C junction temperature using a single non-repetitive pulse method.
Maximum power dissipation at indicated junction temperature with no heat sink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
I
OUT
(6)
(3)
T
(7)
0.5 A
A
(2)
(8)
(4)
= 25 C)
(7)
(1)
(9)
(4)
,
Rating
(5)
CS
ELECTRICAL CHARACTERISTICS
, SFPD, or
ZAP
resistor in series with V
= 200pF, R
(10)
,
RST
(11)
MAXIMUM RATINGS
pins may cause permanent damage to the device.
ZAP
= 0
PWR
).
JA.
pin and supply.
ZAP
V
I
V
OUT(CONT)
V
I
Symbol
PWR(SUS)
E
OUT(OFF)
OUT(LIM)
= 200 pF, R
PWR(PK)
V
V
T
T
CLAMP
V
ESD1
ESD2
f
V
PPRT
T
P
SPI
STG
T
DD
IN
C
D
J
ZAP
Analog Integrated Circuit Device Data
= 1500 ), ESD2 testing is performed in
-1.5 to 26.5
-0.3 to 7.0
-0.3 to 7.0
-55 to 150
-40 to 125
-40 to 150
1.0 to 3.0
-13 to 60
45 to 65
Note 11.
Value
±2000
±200
500
3.0
2.0
50
Freescale Semiconductor
MHz
Unit
mA
mJ
°C
W
V
V
V
V
A
V
C
C
C