TLE6228GP Infineon Technologies, TLE6228GP Datasheet - Page 4

• Manufacturer Part Number: TLE6228GP
• Description: IC SW SMART QUAD LOWSIDE PDSO20
• Manufacturer: Infineon Technologies
• Type: Low Sider

Specifications of TLE6228GP

• Input Type: Non-Inverting
• Number Of Outputs: 4
• On-state Resistance: 230 mOhm, 280 mOhm
• Current - Peak Output: 5.5A, 7.5A
• Voltage - Supply: 4.8 V ~ 32 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: DSO-20
• Switch Type: Low Side
• Power Switch Family: TLE 6228
• Input Voltage: -0.3 to 6V
• Power Switch On Resistance: 350mOhm
• Output Current: 3A
• Mounting: Surface Mount
• Supply Current: 8mA
• Package Type: DSO
• Operating Temperature (min): -40C
• Operating Temperature (max): 150C
• Operating Temperature Classification: Automotive
• Pin Count: 22
• Packages: PG-DSO-20
• Thermal Class: Heatslug down
• Id Nom: 4 x 1 A
• Channels: 4.0
• Comment: general purpose, direct control and status pins
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Compliant
• Other names: SP000012154; SP000308874; SP000801282; TLE6228GP; TLE6228GPNT; TLE6228GPT; TLE6228GPT; TLE6228GPTR

Minimum footprint
Maximum Ratings for T
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the IC will result.
Parameter
Supply voltage
Continuous drain source voltage (OUT1...OUT4)
Input voltage IN1 to IN4, ENA
Input voltage STBY
Status output voltage
Load Dump Protection V
R I
With R
(I
Operating temperature range
Storage temperature range
Output current per channel (see page 6)
Status output current
Inductive load switch off energy (single pulse)
Electrostatic Discharge Voltage (human body model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040
IEC Climatic Category, DIN IEC 68-1
Thermal resistance
junction – case (die soldered on the frame)
junction - ambient @ min. footprint
junction - ambient @ 6 cm
1
2
V4.1
) R
) V
D
1
) =2
= 2,7A respectively 1,35A)
I
LoadDump
=internal resistance of the load dump test pulse generator LD200
L
= 5
; t d =400ms; IN = low or high
is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
for Ch. 1,2; 10
Load Dump
2
cooling area
for Ch. 3,4
j
= U P +U S ; U P =13.5 V
= – 40°C to 150°C
Page
T
j
= 25°C
PCB with heat pipes,
backside 6 cm
4
D a t a s h e e t T L E 6 2 2 8 G P
Symbol
V
V
V
V
V
V
T
T
I
I
E
R
R
D(lim)
ST
V
j
stg
S
DS
IN
STBY
ST
Load Dump
AS
thJC
thJA
ESD
, V
ENA
2
cooling area
2
)
Values
2000
E
40/150/56
2
50
38
- 40 ... + 150
- 55 ... + 150
- 0.3 ... + 40
- 0.3 ... + 32
-0.3 ... + 40
- 0.3 ... + 6
- 5 ... + 5
2010-07-10
I
D(lim) min
45
55
50
Unit
K/W
mA
mJ
°C
V
V
V
V
V
A
V