MC33888FB Freescale Semiconductor, MC33888FB Datasheet - Page 8

• Manufacturer Part Number: MC33888FB
• Description: IC SWITCH QUAD H-SIDE W/CS 64QFP
• Manufacturer: Freescale Semiconductor
• Type: High Side/Low Side Driverr

Specifications of MC33888FB

• Input Type: SPI
• Number Of Outputs: 12 ( 4 High Side, 8 Low Side)
• On-state Resistance: 40 mOhm
• Current - Output / Channel: 10A
• Current - Peak Output: 60A
• Voltage - Supply: 6 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 64-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 4. Maximum Ratings
permanent damage to the device.
8
33888
ELECTRICAL CONNECTIONS
MAXIMUM RATINGS
ELECTRICAL RATINGS
Notes
Power Supply Voltage
Input Pin Voltage
WAKE Input Pin Clamp Current
Continuous per Output Current
Continuous per Output Current
Output Clamp Energy
ESD Voltage
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
5.
6.
7.
Steady State
Low-Sides 4, 6, 8, 10
Low-Sides 5, 7, 9, 11
High-Sides 0, 1
High-Sides 2, 3
High-Sides 0, 1
High-Sides 2, 3
Low-Sides
Human Body Model
Machine Model
Exceeding voltage limits on SCLK, SI, CS, WDIN, RST, IHS, FSI, or ILS pins may cause a malfunction or permanent damage to the
device.
Continuous low-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient
temperature will require calculation of maximum output current using package thermal resistance.
Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient
temperature will require calculation of maximum output current using package thermal resistance.
Active HS0 and HS1 clamp energy using the following conditions: single nonrepetitive pulse, V
Active HS2 and HS3 clamp energy using the following conditions: single nonrepetitive pulse, V
Active low-side clamp energy using the following conditions: single nonrepetitive pulse, 450 mA, T
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
(7)
(6)
(1)
(4)
(5)
(2)
(3)
Ratings
ZAP
ELECTRICAL CONNECTIONS
= 200 pF, R
MAXIMUM RATINGS
ZAP
= 0 Ω).
ZAP
= 100 pF, R
Symbol
I
I
V
V
V
OUTLS
OUTHS
I
E
E
E
V
WICI
ESD1
ESD2
PWR
HS
HS
LS
IN
ZAP
Analog Integrated Circuit Device Data
= 1500 Ω), ESD2 testing is performed in
PWR
PWR
J
= 16.0 V, L = 40 mH, T
= 16.0 V, L = 10 mH, T
= 150°C.
- 0.3 to 7.0
-16 to 41
± 2000
Value
± 200
500
800
450
120
2.5
5.0
10
50
Freescale Semiconductor
J
J
= 150°C.
= 150°C.
Unit
mA
mA
mJ
V
V
A
V