MC33186VW1R2 Freescale Semiconductor, MC33186VW1R2 Datasheet - Page 15

• Manufacturer Part Number: MC33186VW1R2
• Description: IC DRIVER H-BRIDGE 20-HSOP
• Manufacturer: Freescale Semiconductor
• Type: H Bridger

Specifications of MC33186VW1R2

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 150 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: 6.5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• Supply Voltage (min): 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: H Bridge
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 4
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

performance. The particularity of this package is its copper
base plate on which the power die is soldered. The base plate
is soldered on a PCB to provide heat flow to the ambient and
also to provide a large thermal capacitance.
the power dissipation and transient behavior.
The bottom side area of the copper is 7.8 cm
surface is 2.7 cm
Analog Integrated Circuit Device Data
Freescale Semiconductor
The 20 HSOP package is designed for enhanced thermal
Of course, the more copper area on the PCB, the better
We characterized the 20 HSOP on a double side PCB.
Top Side
Figure 26. PCB Test Layout
2
, see
Figure
26.
Bottom Side
2
. The top
PACKAGING
SOLDERING
soldered on to the test PCB described on
Figure 27
Rth (°C/W)
100
0,1
10
1
0,001
Figure 27. PHSOP20 Thermal Response
shows the thermal response with the device
0,01
0,1
1
t, Time (s)
10
100
Figure
1000
PACKAGING
SOLDERING
26.
10000
33186
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