VND830MSP-E STMicroelectronics, VND830MSP-E Datasheet
VND830MSP-E
Specifications of VND830MSP-E
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VND830MSP-E Summary of contents
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... I V OUT CC ( Description The VND830MSP monolithic device made using STMicroelectronics™ VIPower™ M0-3 technology intended for driving any kind of load with one side connected to ground. Active V pin voltage clamp protects the device against CC low energy spikes (see ISO7637 transient compatibility table). ...
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... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.1 ECOPACK 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2/28 Solution 1: resistor in the ground line (RGND only Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18 ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Doc ID 10903 Rev 3 VND830MSP ...
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... VND830MSP-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data Table 5. Power output Table 6. Switching ( Table 7. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 10. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 12 ...
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... PowerSO-10 thermal impedance junction ambient single pulse Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32. PowerSO-10 suggested pad layout and tube shipment (no suffix Figure 33. Tape and reel shipment (suffix “TR” 4/ case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Doc ID 10903 Rev 3 VND830MSP-E ...
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... VND830MSP-E 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE CLAMP UNDERVOLTAGE CLAMP 1 DRIVER 1 CURRENT LIMITER 1 ...
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... INPUT1 OUTPUT1 I STAT1 STATUS 1 STAT1 I IN2 OUTPUT2 INPUT2 V IN2 I STAT2 STATUS 2 V GND STAT2 I GND during reverse battery condition. Table 3 Parameter C = 100 pF) Doc ID 10903 Rev 3 VND830MSP ( OUT1 V OUT1 I OUT2 V OUT2 may cause permanent damage to the Value 41 -0.3 -200 Internally limited -6 +/- 10 +/- 10 ...
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... VND830MSP-E Table 3. Absolute maximum ratings (continued) Symbol Maximum switching energy 0.18 mH; R MAX T jstart P Power dissipation at T tot T Junction operating temperature j T Case operating temperature c T Storage temperature STG 2.2 Thermal data Table 4. Thermal data Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 1 ...
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... 1.3 V OUT R = 6.5 from V L edge 11.7 V OUT R = 6.5 from 10.4 V OUT R = 6.5 from 1.3 V OUT Parameter Test conditions Doc ID 10903 Rev 3 VND830MSP-E < -40 °C < T < 150 °C, unless j Min. Typ. 5 ° 3 Min Typ rising edge falling ...
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... VND830MSP-E Table 7. Logic input (continued) Symbol V Input high level IH I High level input current IH V Input hysteresis voltage I(hyst) V Input clamp voltage ICL Table Symbol Parameter V Forward on voltage -I F Table 9. Status pin Symbol Parameter V Status low output voltage I STAT I Status leakage current ...
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... Overvoltage Output voltage > V Output current < 10/28 Parameter OUT < > V OUT OL OUT OL t DOL(on) Input Doc ID 10903 Rev 3 VND830MSP-E Test conditions Min Typ = 5 V 0.6 0 1.5 2.5 OVER TEMP STATUS TIMING T > TSD V INn V STATn t SDL Output Sense < TSD (T > TSD L L ...
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... VND830MSP-E Figure 5. Switching time waveforms Table 13. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 14. Electrical transient requirements on V ISO T/R 7637/1 Test pulse Test levels I II -25 V -50 V +25 V +50 V -25 V -50 V + +26.5 V +46.5 V Test levels results I II ...
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... Class C E 12/28 All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 10903 Rev 3 VND830MSP-E pin (part 3) CC Contents ...
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... VND830MSP-E Figure 6. Waveforms INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS V CC INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT CURRENT STATUS n NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull-up ...
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... Figure 12. Satus clamp voltage Vscl (V) 8 7.8 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 100 125 150 175 Doc ID 10903 Rev 3 VND830MSP-E High level input current Vin=3.25V - 100 125 150 Tc (°C) Vstat=5V - 100 125 150 Tc (°C) Istat=1mA ...
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... VND830MSP-E Figure 13. On-state resistance vs T Ron (mOhm) 160 140 Iout=2A Vcc=8V; 13V & 36V 120 100 -50 - (°C) Figure 15. Open-load on-state detection threshold Iol (mA) 1250 1200 Vcc=13V 1150 Vin=5V 1100 1050 1000 950 900 850 800 750 -50 - (ºC) Figure 17. Input high level Vih (V) 3 ...
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... Figure 22. Turn-off voltage slope dVout/dt(off) (V/ms) 600 550 500 450 400 350 300 250 200 100 125 150 175 100 125 150 175 Doc ID 10903 Rev 3 VND830MSP-E - 100 125 Tc (°C) Vcc=13V Rl=6.5Ohm -50 - 100 125 Tc (ºC) 150 175 150 175 ...
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... VND830MSP-E 3 Application information Figure 24. Application schematic +5V R prot prot 3.1 GND protection network against reverse battery 3.1.1 Solution 1: resistor in the ground line (R This can be used with any type of load. The following is an indication on how to dimension the 600 GND GND CC where -I is the DC reverse ground pin current and can be found in the absolute GND maximum rating section of the device’ ...
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... GND = 1 k should be inserted in parallel to D Table 13 prot GND µ 20 mA; V latchup OH PU Doc ID 10903 Rev 3 VND830MSP-E Section 3.1.2). if the device drives an GND ) in line to prevent prot IHmax 4 µ ) connected between PU ) like the +5 V line used to supply the line CC line, CC ...
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... VND830MSP false open-load indication when load is connected: in this case we have to avoid V condition V OUT 2. No misdetection when load is disconnected: in this case the V condition R PU Because I may significantly increase if V s(OFF) up resistor R should be connected to a supply that is switched OFF when the module standby ...
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... Values are generated with R In case of repetitive pulses, T the temperature specified above for curves B and C. 20/28 1 L(mH) = 150 °C jstart = 100 °C jstart = 125 °C jstart Demagnetization Demagnetization = 0 L (at beginning of each demagnetization) of every pulse must not exceed jstart Doc ID 10903 Rev 3 VND830MSP-E ( 100 Demagnetization t ...
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... VND830MSP-E 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 27. PowerSO-10 PC board 1. Layout condition thickness = 35 µm, Copper areas: from minimum pad lay-out Figure 28. R thj-amb RTHj_amb (°C/ (1) and Z measurements (PCB FR4 area = mm, PCB thickness = 2 mm PCB copper area in open box free air condition ...
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... Figure 29. PowerSO-10 thermal impedance junction ambient single pulse ZTH (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 Pd2 22/28 0.01 0.1 Time ( – THtp Doc ID 10903 Rev 3 VND830MSP 100 1000 T_amb 2 0 ...
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... VND830MSP-E Table 16. Thermal parameter Area/island ( (° (° (° (° (° (° (W.s/ °C) C2 (W.s /°C) C3 (W.s/ °C) C4 (W.s/ °C) C5 (W.s/ °C) C6 (W.s/ °C) Doc ID 10903 Rev 3 Package and PCB thermal data 0.5 6 0.15 0.8 0.7 0 0.0006 2.10E-03 0.013 0.3 0. 23/28 ...
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... ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 mechanical data Figure 31. PowerSO-10 package dimensions 0. 24/28 packages B E2 SEATING PLANE DETAIL "A" DETAIL "A" Doc ID 10903 Rev 3 VND830MSP-E 0. SEATING PLANE A1 L ® ...
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... VND830MSP-E Table 17. PowerSO-10 mechanical data Dim (1) L (1) 1. Muar only POA P013P. Package and packing information Millimeters Min. Typ. 3.35 3.4 0 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0° ...
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... P0 (± 0. (± 0.1/-0) 1.5 D1 (min) 1.5 F (± 0.05) 11.5 K (max) 6.5 P1 (± 0.1) 2 End Top cover tape Doc ID 10903 Rev 3 VND830MSP 1000 532 10.4 16.4 1000 532 4.9 17.2 REEL DIMENSIONS Base Q.ty 600 Bulk Q.ty 600 A (max) 330 B (min) 1.5 C (± ...
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... VND830MSP-E 6 Revision history Table 18. Document revision history Date 01-Oct-2004 19-Jul-2010 25-Feb-2011 Revision 1 Initial release. Changed Features list. 2 Reformatted entire document. No content change. Updated Figure 26: Maximum turn- off current versus load 3 (1) inductance Doc ID 10903 Rev 3 Revision history Changes 27/28 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 28/28 Please Read Carefully: © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 10903 Rev 3 VND830MSP-E ...