VND810MSP STMicroelectronics, VND810MSP Datasheet - Page 20

• Manufacturer Part Number: VND810MSP
• Description: IC DRVR HISIDE 2CH POWERSO10
• Manufacturer: STMicroelectronics
• Type: High Sider

Specifications of VND810MSP

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 150 mOhm
• Current - Peak Output: 900mA
• Voltage - Supply: 5.5 V ~ 36 V
• Mounting Type: Surface Mount
• Package / Case: PowerSO-10 Exposed Bottom Pad
• Supply Voltage (min): 5.5 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 52000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package and PCB thermal data
4
4.1
Note:
20/27
Package and PCB thermal data
PowerSO-10 thermal data
Figure 27. PowerSO-10 PC board
Layout condition of R
thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad lay-out to 8cm
Figure 28. R
55
50
45
40
35
30
RTHj_amb (°C/ W)
0
thj-amb
th
Vs PCB copper area in open box free air condition
and Z
2
th
measurements (PCB FR4 area = 58mm x 58mm, PCB
PCB Cu heatsink area (cm^ 2)
4
6
Tj-Tamb=50°C
8
VND810MSP
10
2
).