NUD3112DMT1G ON Semiconductor, NUD3112DMT1G Datasheet - Page 7

• Manufacturer Part Number: NUD3112DMT1G
• Description: MOSFT N-CH DUAL 14V 500MA SC74-6
• Manufacturer: ON Semiconductor
• Type: Low Sider

Specifications of NUD3112DMT1G

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 1.2 Ohm
• Current - Output / Channel: 400mA
• Current - Peak Output: 500mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Configuration: Dual
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.9 Ohm @ 5 V
• Drain-source Breakdown Voltage: 14 V
• Gate-source Breakdown Voltage: 6 V
• Continuous Drain Current: 0.5 A
• Power Dissipation: 380 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Supply Voltage Max: 14V
• No. Of Outputs: 2
• Output Voltage: 14V
• Output Current: 400mA
• Driver Case Style: SC-74
• Device Type: Relay
• Termination Type: SMD
• No. Of Pins: 6
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NUD3112DMT1GOS; NUD3112DMT1GOS; NUD3112DMT1GOSTR

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0.05 (0.002)
H
E
*For additional information on our Pb−Free strategy and soldering
0.028
e
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.7
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
0.074
1.9
D
5
2
3
4
SOLDERING FOOTPRINT*
0.039
b
1.0
A
E
0.094
2.4
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
http://onsemi.com
L
CASE 318F−05
SCALE 10:1
ISSUE M
SC−74
C
7
q
inches
0.037
0.037
mm
0.95
0.95
NOTES:
STYLE 7:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318F−01, −02, −03, −04 OBSOLETE. NEW
DIM
PIN 1. SOURCE 1
H
A1
A
b
c
D
E
e
L
q
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
STANDARD 318F−05.
E
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
−
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.051
0.034
0.008
0.099
0.114
MIN
0°
INCHES
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
NOM
NUD3112/D
−
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°