TDE1897RDP STMicroelectronics, TDE1897RDP Datasheet
TDE1897RDP
Specifications of TDE1897RDP
Available stocks
Related parts for TDE1897RDP
TDE1897RDP Summary of contents
Page 1
... TDE1897R TDE1898R 0.5A HIGH-SIDE DRIVER MULTIPOWER BCD TECHNOLOGY Minidip SIP9 ORDERING NUMBERS: TDE1897RDP TDE1898RSP TDE1898RDP ogy, for driving inductive or resistive loads. An in- ternal Clamping Diode enables the fast demag- netization of inductive loads. Diagnostic for CPU feedback and extensive use of electrical protections make this device inher- ently indistructible and suitable for general pur- pose industrial applications ...
Page 2
TDE1897R - TDE1898R PIN CONNECTIONS (Top view) Minidip SIP9 ABSOLUTE MAXIMUM RATINGS (Minidip pin reference) Symbol V Supply Voltage (Pins – V Supply to Output Differential Voltage. See also Input ...
Page 3
ELECTRICAL CHARACTERISTICS (V Symbol Parameter V 3 Supply Voltage for Valid smin Diagnostics V 3 Supply Voltage (operative Quiescent Current out os V Undervoltage Threshold 1 sth1 V 3 Undervoltage Threshold ...
Page 4
TDE1897R - TDE1898R SOURCE DRAIN NDMOS DIODE Symbol Parameter V 2-3 Forward On Voltage fsd I 2-3 Forward Peak Current fp t 2-3 Reverse Recovery Time rr t 2-3 Forward Recovery Time fr THERMAL CHARACTERISTICS (*) Lim Junction Temp. Protect. ...
Page 5
APPLICATION INFORMATION DEMAGNETIZATION OF INDUCTIVE LOADS An internal zener diode, limiting the voltage across the Power MOS to between 45 and 55V (V ), provides safe and fast demagnetization of cl inductive loads without external clamping devices. The maximum energy ...
Page 6
TDE1897R - TDE1898R WORST CONDITION POWER DISSIPATION IN THE ON-STATE In IPS applications the maximum average power dissipation occurs when the device stays for a long time in the ON state. In such a situation the internal temperature depends on ...
Page 7
All electrical parameters of the device, con- cerning the calculation, are at maximum val- ues. - Thermal shutdown threshold is at minimum value heat sink nor air circulation ( thj-amb Therefore: ...
Page 8
TDE1897R - TDE1898R Figure 6: Max. Output Current vs. Ambient Temperature (Minidip Package 100 C/W) th j-amb (mA) 600 500 400 300 200 100 Figure 8: Max. Output Current vs. Ambient Temperature (SIP9 ...
Page 9
DIM. MIN. TYP. MAX. MIN. A 3.32 a1 0.51 0.020 B 1.15 1.65 0.045 b 0.356 0.55 0.014 b1 0.204 0.304 0.008 D 10.92 E 7.95 9.75 0.313 e 2.54 e3 7.62 e4 7.62 F 6.6 I 5.08 L ...
Page 10
TDE1897R - TDE1898R mm DIM. MIN. TYP. MAX. A 7 24.8 b1 0.5 b3 0.85 1.6 C 3.3 c1 0.43 c2 1.32 D 21.2 d1 14.5 e 2.54 e3 20. ...
Page 11
DIM. MIN. TYP. MAX. MIN. A 2.35 2.65 0.093 A1 0.1 0.3 0.004 B 0.33 0.51 0.013 C 0.23 0.32 0.009 D 12.6 13 0.496 E 7.4 7.6 0.291 e 1. 10.65 0.394 h 0.25 0.75 0.010 ...
Page 12
... STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. ...