VND810SP STMicroelectronics, VND810SP Datasheet - Page 7

• Manufacturer Part Number: VND810SP
• Description: IC DRIVER 2CH HI-SIDE POWERSO-10
• Manufacturer: STMicroelectronics
• Type: High Sider

Specifications of VND810SP

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 160 mOhm
• Current - Peak Output: 5A
• Voltage - Supply: 5.5 V ~ 36 V
• Mounting Type: Surface Mount
• Package / Case: PowerSO-10 Exposed Bottom Pad
• Supply Voltage (min): 5.5 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 52000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Operating Temperature: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-3305-5

VND810SP
2.2
2.3
Thermal data
Table 4.
1. When mounted on a standard single-sided FR-4 board with 0.5 cm
2. When mounted on a standard single-sided FR-4 board with 6 cm
Electrical characteristics
Values specified in this section are for 8 V < V
otherwise stated.
Figure 3.
1. V
Symbol
R
R
to all V
all V
thj-case
thj-amb
Fn
= V
CC
CC
V
pins. Horizontal mounting and no artificial air flow.
CCn
IN1
pins. Horizontal mounting and no artificial air flow.
Thermal resistance junction-case
Thermal resistance junction-ambient
- V
Thermal data (per island)
Current and voltage conventions
V
STAT1
OUTn
I
IN1
V
IN2
during reverse battery condition.
V
STAT2
I
I
I
STAT2
STAT1
IN2
Parameter
Doc ID 7377 Rev 4
STATUS 2
INPUT 2
STATUS 1
INPUT 1
GND
CC
(1)
< 36 V; -40 °C < T
I
OUTPUT 1
OUTPUT 2
GND
2
V
of Cu (at least 35 µm thick) connected to
2
CC
of Cu (at least 35 µm thick) connected
52.4
(1)
Electrical specifications
I
V
j
OUT2
Value
F1
< 150 °C, unless
2.4
V
(*)
OUT2
I
V
OUT1
37
OUT1
(2)
V
I
S
CC
°C/W
°C/W
Unit
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