VND830SP13TR STMicroelectronics, VND830SP13TR Datasheet

IC DRIVER 2CH HI-SIDE POWERSO-10

VND830SP13TR

Manufacturer Part Number
VND830SP13TR
Description
IC DRIVER 2CH HI-SIDE POWERSO-10
Manufacturer
STMicroelectronics
Type
High Sider
Datasheet

Specifications of VND830SP13TR

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
60 mOhm
Current - Peak Output
9A
Voltage - Supply
5.5 V ~ 36 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Supply Voltage (min)
5.5 V
Supply Current
40 mA
Maximum Power Dissipation
73500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Switch Type
High Side
Power Switch On Resistance
60mOhm
Output Current
9A
Package Type
PowerSO
Operating Temperature (min)
-40C
Operating Temperature (max)
150C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
10
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-3306-2

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
VND830SP13TR
Manufacturer:
PANASONIC
Quantity:
100
Part Number:
VND830SP13TR
Quantity:
4 800
Part Number:
VND830SP13TR
Manufacturer:
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Part Number:
VND830SP13TR
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VND830SP13TR
Manufacturer:
ST
Quantity:
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Features
1. Per each channel.
Table 1.
February 2011
VND830SP
CMOS compatible inputs
Open Drain status outputs
On-state open-load detection
Off-state open-load detection
Shorted load protection
Undervoltage and overvoltage shutdown
Loss of ground protection
Very low standby current
Reverse battery protection
Type
PowerSO-10
Device summary
Package
60m
R
DS(on)
(1)
6A
I
OUT
(1)
V
36V
CC
Doc ID 7380 Rev 4
VND830SP
Tube
Description
The VND830SP is a monolithic device designed
in|
Technology. The VND830SP is intended for
driving any type of multiple load with one side
connected to ground.
The active V
device against low energy spikes (see ISO7637
transient compatibility table). Active current
limitation combined with thermal shutdown and
automatic restart protects the device against
overload.
The device detects the open-load condition in
both the on-state and off-state. In the off-state the
device detects if the output is shorted to V
device automatically turns off in the case where
the ground pin becomes disconnected.
Double channel high-side driver
STMicroelectronics™ VIPower™ M0-3
Order codes
CC
10
pin voltage clamp protects the
PowerSO-10
VND830SP13TR
Tape and reel
VND830SP
1
www.st.com
CC
. The
1/28
1

Related parts for VND830SP13TR

VND830SP13TR Summary of contents

Page 1

... In the off-state the device detects if the output is shorted to V device automatically turns off in the case where the ground pin becomes disconnected. Tube VND830SP Doc ID 7380 Rev 4 VND830SP 10 1 PowerSO-10 pin voltage clamp protects the CC Order codes Tape and reel VND830SP13TR . The CC 1/28 www.st.com 1 ...

Page 2

Contents Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical ...

Page 3

VND830SP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

VND830SP 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for ...

Page 6

... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. ...

Page 7

VND830SP 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 all V pins. Horizontal mounting and ...

Page 8

Electrical specifications Table 5. Power output Symbol Parameter Operating supply V CC voltage V Undervoltage shutdown USD V Overvoltage shutdown OV R On-state resistance ON I Supply current S I Off-state output current V L(off1) I Off-state output current V ...

Page 9

VND830SP Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL ...

Page 10

Electrical specifications Figure 4. Status timings OPEN LOAD STATUS TIMING (with external pull-up) V INn V STATn t DOL(off) Figure 5. Switching characteristics 10/27 I < > V OUT OL OUT OL t DOL(on) Doc ID 7380 Rev ...

Page 11

VND830SP Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. ...

Page 12

Electrical specifications Figure 6. Waveforms INPUT n LOAD VOLTAGE STATUS INPUT n LOAD VOLTAGE STATUS V CC INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS ...

Page 13

VND830SP 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - 100 Tc (°C) Figure 9. Input clamp ...

Page 14

Electrical specifications Figure 13 LIM case Ilim ( Vcc=13V -50 - (°C) Figure 15. Input high level Vih (V) 3.6 3.4 ...

Page 15

VND830SP Figure 19. Status leakage current Ilstat (uA) 0.05 0.04 Vstat=5V 0.03 0.02 0.01 0 -50 - (°C) Figure 21. Status clamp voltage Vscl (V) 8 7.8 Istat=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 ...

Page 16

Application information 3 Application information Figure 24. Application schematic +5V R prot R C prot R prot R prot 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. ...

Page 17

VND830SP Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of ...

Page 18

Application information 3.4 Open-load detection in off-state Off-state open-load detection requires an external pull-up resistor (R OUTPUT pin and a positive supply voltage (V microprocessor. The external resistor has to be selected according to the following requirements false ...

Page 19

VND830SP 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse ...

Page 20

Package and PCB thermal data 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 27. PowerSO-10 PC board Note: Layout condition of R thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out ...

Page 21

VND830SP Figure 29. Thermal impedance junction ambient single pulse Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 ...

Page 22

Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) ...

Page 23

VND830SP 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...

Page 24

Package and packing information Table 15. PowerSO-10 mechanical data DIM (1) L ...

Page 25

VND830SP 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component ...

Page 26

Revision history 6 Revision history Table 16. Document revision history Date 09-Sep-2004 03-Mar-2008 09-Dec-2008 07-Feb-2011 26/27 Revision 1 Initial release. Current and voltage convention update (page 2). Configuration diagram (top view) & suggested connections for unused and n.c. pins insertion ...

Page 27

... VND830SP Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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