HIP6601BCB Intersil, HIP6601BCB Datasheet - Page 9

IC DRIVER MOSFET DUAL 8-SOIC

HIP6601BCB

Manufacturer Part Number
HIP6601BCB
Description
IC DRIVER MOSFET DUAL 8-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HIP6601BCB

Configuration
High and Low Side, Synchronous
Input Type
PWM
Current - Peak
400mA
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
15V
Voltage - Supply
10.8 V ~ 13.2 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Delay Time
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIP6601BCB
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
HIP6601BCB-T
Manufacturer:
ITS
Quantity:
4 253
Part Number:
HIP6601BCB-T
Manufacturer:
RENESAS
Quantity:
4 932
Part Number:
HIP6601BCB-T
Manufacturer:
INTERSIL
Quantity:
7 500
Part Number:
HIP6601BCB-T
Manufacturer:
INTERSIL
Quantity:
10 000
Part Number:
HIP6601BCB-T
Manufacturer:
INTRESIL
Quantity:
20 000
Company:
Part Number:
HIP6601BCB-T
Quantity:
1 800
Part Number:
HIP6601BCBZ
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
HIP6601BCBZ-T
Manufacturer:
INTERSIL
Quantity:
37 500
Part Number:
HIP6601BCBZ-T
Manufacturer:
INTERSIL
Quantity:
20 000
Company:
Part Number:
HIP6601BCBZ-T
Quantity:
440
Small Outline Exposed Pad Plastic Packages (EPSOIC)
N
N
1
1
0.25(0.010)
2
2
-A-
TOP VIEW
SIDE VIEW
BOTTOM VIEW
INDEX
AREA
3
3
e
B
D
P
M
C A
SEATING PLANE
M
P1
-C-
E
-B-
B S
A
9
H
A1
α
0.25(0.010)
0.10(0.004)
HIP6601B, HIP6603B, HIP6604B
M
L
h x 45
B
M
o
C
M8.15B
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
SYMBOL
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
dimensions are not necessarily exact.
variations. Values shown are maximum size of exposed pad
within lead count and body size.
A1
P1
A
B
C
D
E
H
N
α
P
e
h
L
0.056
0.001
0.0138
0.0075
0.189
0.150
0.230
0.010
0.016
MIN
-
-
0.050 BSC
INCHES
8
MAX
0.066
0.005
0.0192
0.0098
0.196
0.157
0.244
0.016
0.035
0.094
0.094
1.43
0.03
0.35
0.19
4.80
3.31
5.84
0.25
0.41
MILLIMETERS
MIN
-
-
1.27 BSC
8
MAX
1.68
0.13
0.49
0.25
4.98
3.39
6.20
0.41
0.64
2.387
2.387
Rev. 3 6/05
July 20, 2005
NOTES
FN9072.7
11
11
9
3
4
5
6
7
-
-
-
-
-
-

Related parts for HIP6601BCB