L6390D STMicroelectronics, L6390D Datasheet - Page 19

• Manufacturer Part Number: L6390D
• Description: IC DRIVER HV HI/LOW SIDE SOIC-16
• Manufacturer: STMicroelectronics
• Type: High Side/Low Sider

Specifications of L6390D

• Configuration: Half Bridge
• Input Type: Inverting and Non-Inverting
• Delay Time: 125ns
• Current - Peak: 290mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 12.5 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Product: H-Bridge Drivers
• Rise Time: 120 ns
• Fall Time: 70 ns
• Supply Voltage (min): 12.5 V
• Supply Current: 290 mA
• Maximum Power Dissipation: 800 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• For Use With: 497-10543 - BOARD EVAL L6390/STD5N52U497-8404 - BOARD EVAL L6390/STD5NK52ZD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

L6390
10
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 9.
DIM.
®
®
a1
b1
e3
B
D
E
F
Z
b
e
L
I
packages, depending on their level of environmental compliance. ECOPACK®
is an ST trademark.
DIP-16 mechanical data and package dimensions
MIN.
0.51
0.77
17.78
TYP.
0.25
2.54
mm
0.5
8.5
3.3
MAX.
1.65
1.27
7.1
5.1
20
0.020
0.030
MIN.
Doc ID 14493 Rev 5
0.020
0.010
0.335
0.100
0.700
0.130
TYP.
inch
MAX.
0.065
0.787
0.280
0.201
0.050
MECHANICAL DATA
OUTLINE AND
DIP16
Package mechanical data
19/22