L6387ED STMicroelectronics, L6387ED Datasheet

IC DRIVER HI/LO SIDE HV 8-SOIC

L6387ED

Manufacturer Part Number
L6387ED
Description
IC DRIVER HI/LO SIDE HV 8-SOIC
Manufacturer
STMicroelectronics
Type
High Side/Low Sider
Datasheet

Specifications of L6387ED

Configuration
High and Low Side, Independent
Input Type
Non-Inverting
Delay Time
110ns
Current - Peak
400mA
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
600V
Voltage - Supply
17V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Product
Half-Bridge Drivers
Rise Time
50 ns
Fall Time
30 ns
Maximum Power Dissipation
750 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Maximum Turn-off Delay Time
105 ns
Maximum Turn-on Delay Time
110 ns
Minimum Operating Temperature
- 45 C
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Features
September 2008
Figure 1.
High voltage rail up to 600 V
dV/dt immunity ±50 V/nsec in full temperature
range
Driver current capability:
– 400 mA source,
– 650 mA sink
Switching times 50/30 nsec rise/fall with 1nF
load
CMOS/TTL Schmitt trigger inputs with
hysteresis and pull down
Internal bootstrap diode
Outputs in phase with inputs
Interlocking function
V
HIN
LIN
CC
3
2
1
Block diagram
DETECTION
UV
BOOTSTRAP DRIVER
LOGIC
SHIFTER
LEVEL
High-voltage high and low side driver
Rev 2
Description
The L6387E is an high-voltage device,
manufactured with the BCD"OFF-LINE"
technology. It has a Driver structure that enables
to drive independent referenced N Channel Power
MOS or IGBT. The high side (Floating) Section is
enabled to work with voltage Rail up to 600V. The
Logic Inputs are CMOS/TTL compatible for ease
of interfacing with controlling devices.
R
S
DRIVER
LVG
V
CC
DRIVER
HVG
D00IN1135
DIP-8
8
7
6
5
4
Vboot
HVG
OUT
LVG
GND
H.V.
L6387E
TO LOAD
SO-8
Cboot
www.st.com
1/15
15

Related parts for L6387ED

L6387ED Summary of contents

Page 1

Features ■ High voltage rail up to 600 V ■ dV/dt immunity ±50 V/nsec in full temperature range ■ Driver current capability: – 400 mA source, – 650 mA sink ■ Switching times 50/30 nsec rise/fall with 1nF load ■ ...

Page 2

Contents Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

L6387E 1 Electrical data 1.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol V Output voltage out V Supply voltage cc V Floating supply voltage boot V High side gate output voltage hvg V Low side gate output voltage ...

Page 4

Pin connection 2 Pin connection Figure 2. Pin connection (Top view) Table 4. Pin description N° Pin 1 LIN 2 HIN GND (1) 5 LVG 6 VOUT (1) 7 HVG 8 V boot 1. The circuit ...

Page 5

L6387E 3 Electrical characteristics 3.1 AC operation Table 5. AC operation electrical characteristcs (V Symbol Pin off ...

Page 6

Input logic Table 6. DC operation electrical characteristcs (continued)(V Symbol Pin Logic inputs Low level logic threshold V il voltage High level logic threshold V 1,2 ih voltage I High level logic input current ih I Low level logic input ...

Page 7

L6387E 5 Bootstrap driver A bootstrap circuitry is needed to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode integrated structure replaces the external diode realized by a high voltage ...

Page 8

Bootstrap driver For example: using a power MOS with a total gate charge of 30nC the drop on the bootstrap DMOS is about 1V, if the T V has to be taken into account when the voltage drop on C ...

Page 9

L6387E 6 Typical characteristic Figure 4. Typical rise and fall times vs load capacitance time (nsec) 250 200 150 100 For both high and low side buffers @25˚C Tamb Figure 6. Turn on time vs temperature ...

Page 10

Package mechanical data 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package ...

Page 11

L6387E Figure 10. DIP-8 mechanical data and package dimensions mm DIM. MIN. TYP. A 3.32 a1 0.51 B 1.15 b 0.356 b1 0.204 D E 7.95 e 2.54 e3 7. 3.18 Z inch MAX. MIN. ...

Page 12

Package mechanical data Figure 11. SO-8 mechanical data and package dimensions mm DIM. MIN. TYP 0.100 A2 1.250 b 0.280 c 0.170 (1) 4.800 4.900 D E 5.800 6.000 (2) 3.800 3.900 E1 e 1.270 h 0.250 L ...

Page 13

... L6387E 8 Order codes Table 8. Order codes Part number L6387E L6387ED L6387ED013TR Package DIP-8 SO-8 SO-8 Tape and reel Order codes Packaging Tube Tube 13/15 ...

Page 14

Revision history 9 Revision history Table 9. Document revision history Date 11-Oct-2007 19-Sep-2008 14/15 Revision 1 First release 2 Minor text changes on Changes Table 6 L6387E ...

Page 15

... L6387E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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