MCP1406-E/P Microchip Technology, MCP1406-E/P Datasheet - Page 11

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MCP1406-E/P

Manufacturer Part Number
MCP1406-E/P
Description
IC MOSFET DVR 6A 8DIP
Manufacturer
Microchip Technology
Type
Dual High Speed Driverr
Datasheet

Specifications of MCP1406-E/P

Number Of Outputs
1
Package / Case
8-DIP (0.300", 7.62mm)
Configuration
Low-Side
Input Type
Inverting
Delay Time
40ns
Current - Peak
6A
Number Of Configurations
1
Voltage - Supply
4.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Rise Time
30 ns
Fall Time
30 ns
Supply Voltage (min)
4.5 V
Supply Current
0.25 mA
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Number Of Drivers
1
Output Current
6 A
Device Type
MOSFET
Module Configuration
Low Side
Peak Output Current
6A
Output Resistance
2.1ohm
Input Delay
40ns
Output Delay
40ns
Supply Voltage Range
4.5V To 18V
Driver Case Style
DIP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1406-E/P
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP1406-E/PA
Manufacturer:
MICROCHI
Quantity:
20 000
The MCP1406/07 devices have two pins each for V
OUTPUT, and GND. Both pins must be used for proper
operation. This also lowers path inductance which will,
along with proper decoupling, help minimize ringing in
the circuit.
Placing a ground plane beneath the MCP1406/07 will
help as a radiated noise shield as well as providing
some heat sinking for power dissipated within the
device.
4.5
The total internal power dissipation in a MOSFET driver
is the summation of three separate power dissipation
elements.
4.5.1
The power dissipation caused by a capacitive load is a
direct function of frequency, total capacitive load, and
supply voltage. The power lost in the MOSFET driver
for a complete charging and discharging cycle of a
MOSFET is:
© 2006 Microchip Technology Inc.
Where:
Where:
f = Switching frequency
C
V
P
P
P
P
T
DD
T
L
Q
CC
Power Dissipation
= Total load capacitance
= Total power dissipation
= Load power dissipation
= Quiescent power dissipation
= MOSFET driver supply voltage
= Operating power dissipation
CAPACITIVE LOAD DISSIPATION
P
P
T
L
=
=
P
f C
L
×
+
P
T
Q
×
+
V
DD
P
CC
2
DD
,
4.5.2
The power dissipation associated with the quiescent
current draw depends upon the state of the input pin.
The MCP1406/07 devices have a quiescent current
draw when the input is high of 0.13 mA (typ) and
0.035 mA (typ) when the input is low. The quiescent
power dissipation is:
4.5.3
The operating power dissipation occurs each time the
MOSFET driver output transitions because for a very
short period of time both MOSFETs in the output stage
are on simultaneously. This cross-conduction current
leads to a power dissipation describes as:
Where:
Where:
P
Q
CC = Cross-conduction constant (A*sec)
f = Switching frequency
V
I
D = Duty cycle
I
V
QH
QL
=
DD
DD
= Quiescent current in the low state
= Quiescent current in the high state
(
= MOSFET driver supply voltage
= MOSFET driver supply voltage
QUIESCENT POWER DISSIPATION
OPERATING POWER DISSIPATION
I
QH
P
CC
×
D
=
MCP1406/07
+
CC f
I
QL
×
×
(
×
1 D
V
DS22019A-page 11
DD
)
) V
×
DD

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