HIP2101EIBZ Intersil, HIP2101EIBZ Datasheet - Page 9

IC DRIVER HALF BRDG 100V 8EPSOIC

HIP2101EIBZ

Manufacturer Part Number
HIP2101EIBZ
Description
IC DRIVER HALF BRDG 100V 8EPSOIC
Manufacturer
Intersil
Datasheet

Specifications of HIP2101EIBZ

Configuration
Half Bridge
Input Type
PWM
Delay Time
25ns
Current - Peak
2A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
100V
Voltage - Supply
9 V ~ 14 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIP2101EIBZ
Manufacturer:
HARRIS
Quantity:
20 000
Part Number:
HIP2101EIBZT
Manufacturer:
INTERSIL
Quantity:
22 225
SEATING
PLANE
Dual Flat No-Lead Plastic Package (DFN)
Micro Lead Frame Plastic Package (MLFP)
NX b
7
5
2X
INDEX
AREA
2X
INDEX
AREA
6
8
0.15
6
0.15
E2
C
4X
C
C
A
E2/2
0
B
A
BOTTOM VIEW
A1
e
N
1
N
1
N-1
FOR EVEN TERMINAL/SIDE
SIDE VIEW
(Nd-1)Xe
7
2
TOP VIEW
2 3
REF.
3
D2
D1
D
8
D2/2
D1/2
C
D/2
C
L C
9
NX b
2X
e
4X P
A3
0.10
NX k
0.15
A2
E1/2
L
TERMINAL TIP
M
A1
C
C A
A
E1
5
5
A
B
E/2
9
//
0.08
0.10
E
B
2X
C
C
0.15
C
HIP2101
B
L12.4x4A
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. N is the number of terminals.
3. Nd refer to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
6. The configuration of the pin #1 identifier is optional, but must be
7. Dimensions D2 and E2 are for the exposed pads which provide
8. Nominal dimensions are provided to assist with PCB Land Pattern
9. COMPLIANT TO JEDEC MO-229-VGGD-2 ISSUE C except for
SYMBOL
between 0.15mm and 0.30mm from the terminal tip.
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
improved electrical and thermal performance.
Design efforts, see Intersil Technical Brief TB389.
the L dimension.
A1
A2
A3
D1
D2
E1
E2
Nd
A
D
E
N
P
b
e
k
L
θ
0.635
0.00
0.18
2.65
1.43
0.30
0.24
MIN
-
-
-
MILLIMETERS
NOMINAL
4.00 BSC
3.75 BSC
4.00 BSC
3.75 BSC
0.20 REF
0.50 BSC
0.85
0.01
0.65
0.23
2.80
1.58
0.40
0.42
12
6
-
-
MAX
0.90
0.05
0.70
0.30
2.95
1.73
0.50
0.60
12
-
Rev. 0 8/03
NOTES
FN9025.8
5, 8
7, 8
7, 8
8
2
3
-
-
-
-
-
-
-
-
-
-
-
-

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