HIP2101EIBZ Intersil, HIP2101EIBZ Datasheet - Page 11

IC DRIVER HALF BRDG 100V 8EPSOIC

HIP2101EIBZ

Manufacturer Part Number
HIP2101EIBZ
Description
IC DRIVER HALF BRDG 100V 8EPSOIC
Manufacturer
Intersil
Datasheet

Specifications of HIP2101EIBZ

Configuration
Half Bridge
Input Type
PWM
Delay Time
25ns
Current - Peak
2A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
100V
Voltage - Supply
9 V ~ 14 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIP2101EIBZ
Manufacturer:
HARRIS
Quantity:
20 000
Part Number:
HIP2101EIBZT
Manufacturer:
INTERSIL
Quantity:
22 225
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
Small Outline Plastic Packages (SOIC)
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
H
A1
11
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP2101
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AA ISSUE C)
0.0532
0.0040
0.013
0.0075
0.1890
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
INCHES
8
MAX
0.0688
0.0098
0.020
0.0098
0.1968
0.1574
0.2440
0.0196
0.050
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
8
MAX
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
o
Rev. 0 12/93
NOTES
FN9025.8
9
3
4
5
6
7
-
-
-
-
-
-

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