IR2011SPBF International Rectifier, IR2011SPBF Datasheet - Page 2

HI/LO SIDE DRVR 8SOIC

IR2011SPBF

Manufacturer Part Number
IR2011SPBF
Description
HI/LO SIDE DRVR 8SOIC
Manufacturer
International Rectifier
Datasheets

Specifications of IR2011SPBF

Configuration
High and Low Side, Independent
Input Type
Non-Inverting
Delay Time
80ns
Current - Peak
1A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
200V
Voltage - Supply
10 V ~ 20 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Package Type
8-Lead SOIC
Power Dissipation
0.625 W (Package)
Type, Voltage Regulator
Low Dropout
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IR2011SPBF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR2011SPBF
Manufacturer:
IR
Quantity:
15 400
Part Number:
IR2011SPBF
Manufacturer:
IR
Quantity:
20 000
Note 1: Logic operational for V
IR2011(S) & (PbF)
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions. The V S and COM offset ratings
are tested with all supplies biased at 15V differential.
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
Symbol
2
dV
R
V
V
V
V
V
V
V
V
V
T
V
THJA
V
V
P
T
T
HO
T
CC
LO
IN
HO
CC
LO
A
s
B
S
IN
D
B
S
J
S
L
/dt
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic input voltage (HIN & LIN)
Ambient temperature
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic input voltage (HIN & LIN)
Allowable offset supply voltage transient (figure 2)
Package power dissipation @ T
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
S
of -4 to +200V. Logic state held for V
Definition
Definition
A
£ +25°C
(8-lead SOIC)
(8-lead SOIC)
(8-lead DIP)
(8-lead DIP)
S
of -4V to -V
BS
V
V
V
Note 1
Min.
COM
S
Min.
S
.
B
-40
-0.3
-0.3
-0.3
-0.3
V
10
-55
0
+ 10
- 0.3
S
- 25
V
V
V
V
V
Max.
Max.
CC
CC
S
B
0.625
B
V
200
125
5.5
225
125
200
150
150
300
V
20
1.0
25
50
CC
+ 20
+ 0.3
+ 0.3
B
+0.3
+0.3
www.irf.com
Units
Units
°C/W
V/ns
°C
°C
W
V
V

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