TLD5095EL Infineon Technologies, TLD5095EL Datasheet - Page 8

• Manufacturer Part Number: TLD5095EL
• Description: IC DC-DC CTRLR BUCK BOOST 14SSOP
• Manufacturer: Infineon Technologies

Specifications of TLD5095EL

• Constant Current: Yes
• Constant Voltage: Yes
• Topology: PWM, SEPIC, Step-Down (Buck), Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Automotive
• Frequency: 100kHz ~ 500kHz
• Voltage - Supply: 4.75 V ~ 45 V
• Voltage - Output: 4.6 V ~ 5.4 V
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP Exposed Pad, 14-eTSSOP 14-HTSSOP
• Internal Switch(s): *
• Efficiency: *
• Packages: PG-SSOP-14
• Vs (min): 4.75 V
• Vs (max): 45.0 V
• Vq (max): -
• Iq (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Details

Absolute Maximum Ratings
T
(unless otherwise specified)
Pos.
4.1.26
4.1.27
1) Not subject to production test, specified by design.
2) ESD susceptibility, Human Body Model “HBM” according to EIA/JESD 22-A114B
3) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
4.2
Pos.
4.2.1
4.2.2
4.2.3
Note: Within the functional range the IC operates as described in the circuit description. The electrical
4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Pos.
4.3.1
4.3.2
4.3.3
4.3.4
1) Not subject to production test, specified by design.
2) Specified
3) Specified
Datasheet
j
= -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
temperature). Ta=25°C, IC is dissipating 1W.
area at natural convection on FR4 board; The device was simulated on a 76.2 x 114.3 x 1.5mm board. The 2s2p board has
2 outer copper layers (2 x 70µm Cu) and 2 inner copper layers (2 x 35µm Cu), A thermal via (diameter = 0.3mm and 25µm
plating) array was applied under the exposed pad and connected the first outer layer (top) to the first inner layer and second
outer layer (bottom) of the JEDEC PCB. Ta=25°C, IC is dissipating 1W.
maximum rating conditions for extended periods may affect device reliability.
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
characteristics are specified within the conditions given in the related electrical characteristics table.
to www.jedec.org.
Parameter
Supply Voltage Input
Feedback Voltage Input
Junction Temperature
Parameter
Junction to Case
Junction to Ambient
Parameter
ESD Resistivity to GND
ESD Resistivity Pin 1, 7, 8, 14 (corner
pins) to GND
R
R
Functional Range
Thermal Resistance
thJC
thJA
value is simulated at natural convection on a cold plate setup (all pins and exposed pad are fixed to ambient
value is according to JEDEC 2s2p (JESD 51-7) + (JESD 51-5) and JEDEC 1s0p (JESD 51-3) + heatsink
1) 2)
1) 3)
1)
Symbol
V
V
V
T
Symbol
R
R
R
R
j
IN
FBH;
FBL
thJC
thJA
thJA
thJA
Symbol
V
V
ESD,CDM
ESD,CDM,C
8
Min.
4.75
4.5
-40
Min.
–
–
–
–
Limit Values
Limit Values
Typ.
–
47
54
64
Min.
-500
-750
Max.
45
45
150
Limit Values
Max.
10
–
–
–
General Product Characteristics
500
750
Max.
Unit
V
V
°C
Unit
K/W
K/W
K/W
K/W
Unit
V
V
Rev. 1.1, 2009-12-16
Conditions
V
–
–
Conditions
2s2p
1s0p + 600 mm
1s0p + 300 mm
IVCC
Conditions
CDM
CDM
TLD5095EL
>
V
IVCC,RTH,d
3)
3)
2
2