CPC9909NE Clare, CPC9909NE Datasheet - Page 10

• Manufacturer Part Number: CPC9909NE
• Description: IC LED DRVR HIGH BRIGH SOIC-8EP
• Manufacturer: Clare
• Type: HBLED Driverr

Specifications of CPC9909NE

• Mfg Application Notes: CPC9909 Design Considerations
• Constant Current: Yes
• Topology: AC DC Offline Switcher, PWM
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Secondary: High Brightness LED (HBLED)
• Frequency: 30kHz ~ 120 kHz
• Voltage - Supply: 12 V ~ 550 V
• Voltage - Output: 7.8V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
• Operating Temperature: -40°C ~ 85°C
• Internal Switch(s): No
• Efficiency: 90%
• Operating Supply Voltage: 8 V to 550 V
• Maximum Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Details
• Other names: CLA328

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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
CPC9909
3.2 Packaging Information
For both the SOIC-8 and the SOIC-8 EP Packages.
3.3 Soldering
For proper assembly, this component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
10
Embossed Carrier
(13.00 DIA.)
330.2 DIA.
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
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K
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
(0.083)
0
B
(0.209)
= 2.10
0
=5.30
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3.4 Washing
Clare does not recommend ultrasonic cleaning of this
part.
A
(0.256)
0
=6.50
User Direction of Feed
Pb
Specifications: CPC9909 - R01
© Copyright 2010, Clare, Inc.
All rights reserved. Printed in USA.
1/27/10
P=8.00
(0.315)
2002/95/EC
RoHS
e
3
Dimensions
(inches)
mm
W=12.00
(0.472)
R01