NCV3065DR2G ON Semiconductor, NCV3065DR2G Datasheet - Page 18

• Manufacturer Part Number: NCV3065DR2G
• Description: IC LED DRVR HP CONST CURR 8-SOIC
• Manufacturer: ON Semiconductor
• Type: High Power, Constant Currentr

Specifications of NCV3065DR2G

• Constant Current: Yes
• Topology: PWM, SEPIC, Step-Down (Buck), Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Primary: Automotive, General Purpose
• Type - Secondary: High Brightness LED (HBLED)
• Frequency: 250kHz
• Voltage - Supply: 3 V ~ 40 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 125°C
• Current - Output / Channel: 1.5A
• Internal Switch(s): Yes
• Input Voltage: 40 V
• Switching Frequency: 100 KHz to 250 KHz
• Operating Temperature Range: - 40 C to + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCV3065DR2GOSTR

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2X
8X
2X
REFERENCE
NOTE 4
PIN ONE
0.15
0.10
0.08
DETAIL A
0.15
K
C
C
C
e
É É É
É É É
C
BOTTOM VIEW
SIDE VIEW
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç
TOP VIEW
8
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
DETAIL B
D
D2
(A3)
Ç
Ç
4
5
A1
8X
A
B
E
E2
8X
b
A
0.10 C
0.05 C
L
C
SEATING
PLANE
EXPOSED Cu
NOTE 3
A B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
L1
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
Ç Ç É É É É
http://onsemi.com
CASE 488AF−01
8 PIN DFN, 4x4
CONSTRUCTIONS
CONSTRUCTIONS
ISSUE C
MOLD CMPD
DETAIL B
ALTERNATE
DETAIL A
OPTIONAL
18
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
É É Ç Ç
4.30
L
A3
2.39
0.80
PITCH
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. DETAILS A AND B SHOW OPTIONAL
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
CONSTRUCTIONS FOR TERMINALS.
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
2.21
MILLIMETERS
MIN
0.80
0.00
0.25
1.91
2.09
0.20
0.30
−−−
0.20 REF
4.00 BSC
4.00 BSC
0.80 BSC
MAX
DIMENSIONS: MILLIMETERS
1.00
0.05
0.35
2.21
2.39
0.50
0.15
−−−
0.35
8X
0.63
8X
OUTLINE
PACKAGE
NCP3065/D