PCF8534AHL/1,518 NXP Semiconductors, PCF8534AHL/1,518 Datasheet - Page 27
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
PCF8534AHL/1,518
Manufacturer Part Number
PCF8534AHL/1,518
Description
IC LCD DISPLAY DRVR 60SEG 80LQFP
Manufacturer
NXP Semiconductors
Specifications of PCF8534AHL/1,518
Package / Case
80-LQFP
Display Type
LCD
Configuration
60 Segment
Interface
I²C
Current - Supply
8µA
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Number Of Digits
30
Number Of Segments
240
Maximum Clock Frequency
400 KHz
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Power Dissipation
400 mW
Maximum Operating Temperature
+ 85 C
Maximum Supply Current
50 mA
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Digits Or Characters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-5058-2
935289852518
935289852518
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8534AHL/1,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
8. Thermal characteristics
UJA1076_2
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
High-speed CAN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1076
© NXP B.V. 2010. All rights reserved.
015aaa137
Figure
14).
27 of 47