LTC4151IMS#PBF Linear Technology, LTC4151IMS#PBF Datasheet - Page 15

• Manufacturer Part Number: LTC4151IMS#PBF
• Description: IC CURRENT MONITOR(12BIT) 10MSOP
• Manufacturer: Linear Technology

Specifications of LTC4151IMS#PBF

• Function: Current Monitor (12 Bit)
• Sensing Method: High-Side
• Accuracy: ±1%
• Voltage - Input: 7 ~ 80 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Voltage Supervisor Type: Voltage Monitor
• Number Of Voltage Supervisors: 1
• Reset Threshold Voltage (min): 2.3V
• Reset Threshold Voltage (max): 2.9V
• Operating Supply Voltage (min): 7V
• Operating Supply Voltage (max): 80V
• Package Type: MSOP
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
(.0120 ± .0015)
0.305 ± 0.038
TYP
.030 .005
(0.203 – 0.254)
.008 – .010
(.206)
5.23
MIN
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
RECOMMENDED SOLDER PAD LAYOUT
TYP
.245
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(0.254 – 0.508)
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.010 – .020
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
N
1
.050 BSC
(0.406 – 1.270)
.016 – .050
2
45
3
(MILLIMETERS)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.20 – 3.45
INCHES
(.0197)
0.50
BSC
0 – 8 TYP
N/2
.045 .005
16-Lead Plastic Small Outline (Narrow .150 Inch)
.160 .005
GAUGE PLANE
(.007)
0.18
(Reference LTC DWG # 05-08-1661 Rev E)
(Reference LTC DWG # 05-08-1610)
(5.791 – 6.197)
(1.346 – 1.752)
.228 – .244
10-Lead Plastic MSOP
.053 – .069
(.010)
0.254
(0.355 – 0.483)
MS Package
.014 – .019
S Package
TYP
DETAIL “A”
DETAIL “A”
16
N
1
0° – 6° TYP
15
(.021 ± .006)
0.53 ± 0.152
2
14
3
SEATING
PLANE
(9.804 – 10.008)
.386 – .394
13
4
NOTE 3
(1.270)
3.00 ± 0.102
(.118 ± .004)
(.007 – .011)
.050
BSC
(.193 ± .006)
0.17 – 0.27
4.90 ± 0.152
(NOTE 3)
12
5
TYP
(.043)
11
MAX
1.10
6
(.0197)
0.50
10
BSC
10
1 2 3 4 5
7
9
8
N/2
9
8
7 6
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
3.00 ± 0.102
(.118 ± .004)
LTC4151
NOTE 3
(.0196 ± .003)
0.497 ± 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 ± 0.0508
MSOP (MS) 0307 REV E
(.004 ± .002)
S16 0502
REF
15
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