MAX17006BETP+ Maxim Integrated Products, MAX17006BETP+ Datasheet - Page 21

• Manufacturer Part Number: MAX17006BETP+
• Description: IC BATT CHARGER 1.2MHZ 20-TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX17006BETP+

• Function: Charge Management
• Battery Type: Multi-Chemistry
• Voltage - Supply: 8 V ~ 26 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2) Place the IC and signal components. Keep the
c) Minimize other trace lengths in the high-current
d) Use > 5mm wide traces in the high-current
e) Connect C
f) Minimize the LX node (MOSFETs, rectifier cath-
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are
then connected to each other with a wide, filled
zone of top-layer copper, so they do not go through
vias. The resulting top-layer subground plane is
connected to the normal inner-layer ground plane
at the paddle. Other high-current paths should also
be minimized, but focusing primarily on short
ground and current-sense connections eliminates
about 90% of all PCB layout problems.
main switching node (LX node) away from sensitive
analog components (current-sense traces and V
paths.
length).
ode, inductor (15mm max length)). Keep LX on
one side of the PCB to reduce EMI radiation.
paths.
IN
______________________________________________________________________________________
to high-side MOSFET (10mm max
High-Performance Chargers
AA
3) Keep the gate drive traces (DHI and DLO) as short
4) Place ceramic bypass capacitors close to the IC.
5) Use a single-point star ground placed directly
capacitor). Important: the IC must be no further than
10mm from the current-sense resistors. Quiet con-
nections to V
arate ground (GND) island. There is very little current
flowing in these traces, so the ground island need not
be very large. When placed on an inner layer, a siz-
able ground island can help simplify the layout
because the low-current connections can be made
through vias. The ground pad on the backside of the
package should also be connected to this quiet
ground island.
as possible (L < 20mm), and route them away from
the current-sense lines and V
should also be relatively wide (W > 1.25mm).
The bulk capacitors can be placed further away.
Place the current-sense input filter capacitors under
the part, connected directly to the GND pin.
below the part at the PGND pin. Connect the power
ground (ground plane) and the quiet ground island
at this location.
1.2MHz Low-Cost,
AA
and CC should be returned to a sep-
AA
. These traces
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