MD8331-D2G-V3-X SanDisk, MD8331-D2G-V3-X Datasheet - Page 18
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MD8331-D2G-V3-X
Manufacturer Part Number
MD8331-D2G-V3-X
Description
IC MDOC G4 2GB 69-FBGA
Manufacturer
SanDisk
Datasheet
1.MD8832-D1G-V18-X-P.pdf
(85 pages)
Specifications of MD8331-D2G-V3-X
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
2G (256M x 8)
Speed
33ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
69-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MD8331-D2G-V3-X-P
Manufacturer:
INTEL
Quantity:
480
Company:
Part Number:
MD8331-D2G-V3-X-P
Manufacturer:
M-SYSTEM
Quantity:
586
1.
18
DPD
VCC
VCCQ
VSS
RSRVD
Signal
The following abbreviations are used: IN - Standard (non-Schmidt) input, ST - Schmidt Trigger input, OD - Open drain output
See Figure 3
C7, C3, D3,
G3, J9, D8,
C8, F7, E7,
E3, F3, D2,
Pin No.
E2, F2
J6, F4
G2
J5
M
Type
Input
ST
-
-
-
-
1
Deep Power-Down. Used to enter and exit Deep Power-
Down mode. Pin is assigned A0 instead of DPD when
working in 8-bit mode.
Device core supply. Requires a 10 nF and 0.1 µF capacitor.
I/O power supply. Sets the logic 1 voltage level range of I/O
balls. VCCQ may be 1.65V to 1.95V. Requires a 10 nF and
0.1 µF capacitor.
Ground. All VSS pins must be connected.
Reserved. Reserved signals are not connected internally and
must be left floating to guarantee forward compatibility with
future products.
Mechanical. These balls are for mechanical placement, and
are not connected internally.
Data Sheet (Preliminary) Rev. 0.3
Power
Other
Description
DiskOnChip G4 128MB (1Gb)/256MB (2Gb) 1.8V
92-DS-1105-00
Supply
Input
Supply
Supply
Signal
Type