MD5832-D256-V3Q18-X-P SanDisk, MD5832-D256-V3Q18-X-P Datasheet - Page 17

• Manufacturer Part Number: MD5832-D256-V3Q18-X-P
• Description: IC MDOC P3 256MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD5832-D256-V3Q18-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 85-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.3
2.3.1 Pin/Ball Diagram
See Figure 4 and Figure 5 for the Mobile DiskOnChip P3 256Mb pinout/ballout for the multiplexed
interface. To ensure proper device functionality, pins/balls marked RSRVD are reserved for future
use and should not be connected.
Note: Mobile DiskOnChip P3 is designed as a drop-in replacement for second-generation (G2)
TSOP-I Package
14
DMARQ#
RSTIN#
LOCK#
VCCQ
WE#
DPD
DiskOnChip Plus products, assuming that the latter were integrated according to migration
guide guidelines. Refer to application note AP-DOC-067, Preparing your PCB Footprint for
the DiskOnChip BGA Migration Path, for further information.
OE#
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CE#
Vcc
ID0
NC
Multiplexed Interface
Figure 4: Pinout for Multiplexed Interface (Mobile DiskOnChip P3 256Mb TSOP-I Package)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Mobile DiskOnChip P3 256Mb
48-Pin TSOP-I
Data Sheet, Rev. 0.3
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Mobile DiskOnChip P3
93-SR-009-8L
VSS
IRQ#
AD15
AD14
AD13
AD12
AD11
AD10
AD9
AD8
CLK
VCCQ
GND
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
BUSY#
AVD#
VSS