MD5832-D256-V3Q18-X-P SanDisk, MD5832-D256-V3Q18-X-P Datasheet - Page 16

• Manufacturer Part Number: MD5832-D256-V3Q18-X-P
• Description: IC MDOC P3 256MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD5832-D256-V3Q18-X-P

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 85-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13
The following abbreviations are used: IN - Standard (non-Schmidt) input, ST - Schmidt Trigger input, OD - Open drain output, R8 - Nominal
22K pull-up resistor, enabled only for 8-bit interface mode (IF_CFG input is 0)
IRQ#
DPD
VCC
VCCQ
VSS
RSRVD
Signal
See Figure 2
Ball No.
G2, J8
G1
F8
J4
J5
M
A
Input
Type
OD
ST
-
-
-
-
-
-
Device supply. Requires a 10 nF and 0.1 µF
I/O power supply. Sets the logic 1 voltage level
Interrupt Request, active low. A 10 KΩ pull-up
resistor is required if this ball drives an input. A 10
KΩ pull-up resistor is recommended even if this
ball is not used.
Deep Power-Down. Used to enter and exit Deep
Power-Down mode. This ball is assigned A0
instead of DPD when working in 8-bit mode.
capacitor.
range of I/O balls. VCCQ may be either 2.5V to
3.6V or 1.65V to 2.0V. Requires a 10 nF and
0.1 µF capacitor.
Ground. All VSS balls must be connected.
Reserved. All reserved signals are not connected
internally and must be left floating to guarantee
forward compatibility with future products.
Mechanical. These balls are for mechanical
placement, and are not connected internally.
Alignment. This ball is for device alignment and is
not connected internally.
Data Sheet, Rev. 0.3
Power
Other
Description
Mobile DiskOnChip P3
93-SR-009-8L
Supply
Supply
Supply
Signal
Output
Type
Input