MD4832-D512-V3Q18-X/Y SanDisk, MD4832-D512-V3Q18-X/Y Datasheet - Page 71

• Manufacturer Part Number: MD4832-D512-V3Q18-X/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 585-1140

9.2
Mobile DiskOnChip G3 uses a NOR-like interface that can easily be connected to any
microprocessor bus. With a standard interface, it requires 13 address lines, 8 data lines and basic
memory control signals (CE#, OE#, WE#), as shown in Figure 22 below. Typically, Mobile
DiskOnChip G3 can be mapped to any free 8KB memory space. In a PC-compatible platform, it is
usually mapped into the BIOS expansion area. If the allocated memory window is larger than 8KB,
an automatic anti-aliasing mechanism prevents the firmware from being loaded more than once
during the ROM expansion search.
Notes: 1. The 0.1 µF and the 10 nF low-inductance high-frequency capacitors must be attached to
68
(*) Address A0 is multiplexed with the DPD signal.
Standard NOR-Like Interface
2. Mobile DiskOnChip G3 is an edge-sensitive device. CE#, OE# and WE# should be
each of the device’s VCC and VSS pins/balls. These capacitors must be placed as close
as possible to the package leads.
properly terminated (according to board layout, serial parallel or both terminations) to
avoid signal ringing.
Output Enable
Figure 21: Typical System Architecture Using Mobile DiskOnChip G3
Write Enable
Chip Enable
Address*
Chip ID
Reset
Data
0.1 uF
Figure 22: Standard System Interface
A[12:0]
RSTIN#
D[15:0]
OE#
CE#
ID[1:0]
WE#
Preliminary Data Sheet, Rev. 1.1
10 nF
3.3 V
VCC
DiskOnChip G3
0.1 uF
Mobile
VSS
DMARQ#
BUSY#
LOCK#
10 nF
VCCQ
1.8V or 3.3V
DPD
IRQ#
CLK
1-20 KOhm
Mobile DiskOnChip G3
91-SR-011-05-8L