W25X64VSFIG Winbond Electronics, W25X64VSFIG Datasheet - Page 16

IC FLASH 64MBIT 75MHZ 16SOIC

W25X64VSFIG

Manufacturer Part Number
W25X64VSFIG
Description
IC FLASH 64MBIT 75MHZ 16SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X64VSFIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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12.2 INSTRUCTIONS
The instruction set of the W25X16/16A/32/64 consists of fifteen basic instructions that are fully
controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction
code. Data on the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 19. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a
full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects
the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or
when the Status Register is being written, all instructions except for Read Status Register will be
ignored until the program or erase cycle has completed.
12.2.1 Manufacturer and Device Identification
MANUFACTURER ID
Winbond Serial Flash
Device ID
Instruction
W25X16/16A
W25X32
W25X64
W25X16, W25X16A, W25X32, W25X64
(M7-M0)
EFH
(ID7-ID0)
ABh, 90h
14h
15h
16h
- 16 -
(ID15-ID0)
9Fh
3015h
3016h
3017h

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