M24128-BWMN6P STMicroelectronics, M24128-BWMN6P Datasheet

IC EEPROM 128KBIT 400KHZ 8SOIC

M24128-BWMN6P

Manufacturer Part Number
M24128-BWMN6P
Description
IC EEPROM 128KBIT 400KHZ 8SOIC
Manufacturer
STMicroelectronics
Datasheets

Specifications of M24128-BWMN6P

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
128K (16K x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Organization
16 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
2 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 5.5 V
Memory Configuration
16384 X 8
Clock Frequency
400kHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
SO
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8577-5
M24128-BWMN6P

Available stocks

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Quantity
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Part Number:
M24128-BWMN6P
Manufacturer:
STMicroelectronics
Quantity:
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Part Number:
M24128-BWMN6P
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STMicroelectronics
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M24128-BWMN6P
Manufacturer:
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Quantity:
20 000
Features
December 2009
Supports the I
– 400 kHz Fast-mode
– 100 kHz Standard-mode
Single supply voltages:
– 2.5 V to 5.5 V (M24C32-W)
– 1.8 V to 5.5 V (M24C32-R)
– 1.7 V to 5.5 V (M24C32-F)
Write Control input
Byte and Page Write
Random and Sequential Read modes
Self-timed programming cycle
Automatic address incrementing
Enhanced ESD/latch-up protection
More than 1 Million write cycles
More than 40-year data retention
Packages
– SO8, TSSOP8, UFDFPN8 packages:
– PDIP8 package:
ECOPACK2
Halogen-free)
ECOPACK1
2
C bus modes:
®
®
(RoHS-compliant and
(RoHS-compliant)
Doc ID 4578 Rev 17
32 Kbit serial I²C bus EEPROM
M24C32-R M24C32-F
2 × 3 mm (MLP)
UFDFPN8 (MB)
TSSOP8 (DW)
150 mil width
169 mil width
PDIP8 (BN)
SO8 (MN)
M24C32-W
www.st.com
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Related parts for M24128-BWMN6P

M24128-BWMN6P Summary of contents

Page 1

Features 2 ■ Supports the I C bus modes: – 400 kHz Fast-mode – 100 kHz Standard-mode ■ Single supply voltages: – 2 5.5 V (M24C32-W) – 1 5.5 V (M24C32-R) – 1 5.5 ...

Page 2

... Chip Enable (E0, E1, E2 2.4 Write Control (WC 2.5 V ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 SS 2.6 Supply voltage (V 2.6.1 2.6.2 2.6.3 2.6.4 3 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.3 Acknowledge bit (ACK 4.4 Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.5 Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.6 Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 ...

Page 3

M24C32-W M24C32-R M24C32-F 5 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of tables List of tables Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

M24C32-W M24C32-R M24C32-F List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 6

... The Start condition is followed by a device select code and Read/Write bit (RW) (as described in When writing data to the memory, the device inserts an acknowledge bit during the 9 time, following the bus master’s 8-bit transmission. When data is read by the bus master, the bus master acknowledges the receipt of the data byte in the same way ...

Page 7

M24C32-W M24C32-R M24C32-F Table 1. Signal names Signal name E0, E1, E2 SDA SCL Figure 2. DIP, SO, TSSOP and UFDFPN connections 1. See Package mechanical data Function Chip Enable Serial Data Serial Clock Write ...

Page 8

... Device select code 2.4 Write Control (WC) This input signal is useful for protecting the entire contents of the memory from inadvertent write operations. Write operations are disabled to the entire memory array when Write Control (WC) is driven high. When unconnected, the signal is internally read as V Write operations are allowed ...

Page 9

... SS 2.6 Supply voltage (V 2.6.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V Table 9). In order to secure a stable DC supply voltage recommended to decouple the V line with a suitable capacitor (usually of the order 100 nF) close to the ...

Page 10

Signal description Figure 4. Maximum R 100 10 Here R bus × C bus = 120 ns 4 kΩ Figure bus protocol SCL SDA SCL SDA Start Condition SCL SDA 10/38 value versus bus ...

Page 11

... M24C32-W M24C32-R M24C32-F Table 2. Device select code Device select code 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. Table 3. Address most significant byte b15 b14 Table 4. Address least significant byte ...

Page 12

... Memory organization 3 Memory organization The memory is organized as shown in Figure 6. Block diagram SCL SDA 12/38 Figure 6. Control Logic I/O Shift Register Address Register and Counter Doc ID 4578 Rev 17 M24C32-W M24C32-R M24C32-F High Voltage Generator Data Register 1 Page X Decoder AI06899 ...

Page 13

M24C32-W M24C32-R M24C32-F 4 Device operation The device supports the I data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer ...

Page 14

... Serial Data (SDA), most significant bit first). The device select code consists of a 4-bit device type identifier, and a 3-bit Chip Enable “Address” (E2, E1, E0). To address the memory array, the 4-bit device type identifier is 1010b eight memory devices can be connected on a single I unique 3-bit code on the Chip Enable (E0, E1, E2) inputs ...

Page 15

M24C32-W M24C32-R M24C32-F Figure 7. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) ACK ACK Dev select Byte address Byte address R/W ACK ACK Dev select Byte ...

Page 16

... If more bytes are sent than will fit up to the end of the row, a condition known as ‘roll-over’ occurs. This should be avoided, as data starts to become overwritten in an implementation dependent way ...

Page 17

M24C32-W M24C32-R M24C32-F Figure 8. Write mode sequences with (data write enabled) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) ACK ACK Dev Select Byte address Byte address R/W ACK ACK Dev Select Byte ...

Page 18

... Minimizing system delays by polling on ACK During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells. The maximum Write time (t shown in Table 16 be used by the bus master. ...

Page 19

M24C32-W M24C32-R M24C32-F Figure 10. Read mode sequences Current Address Read Random Address Read Sequential Current Read Sequential Random Read 1. The seven most significant bits of the device select code of a Random Read (in the 1 be identical. ...

Page 20

... The output data comes from consecutive addresses, with the internal address counter automatically incremented after each byte output. After the last memory address, the address counter ‘rolls-over’, and the device continues to output data from memory address 00h. 4.14 ...

Page 21

... These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the Operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 6. ...

Page 22

DC and AC parameters 7 DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristic tables that follow are derived from ...

Page 23

M24C32-W M24C32-R M24C32-F Figure 11. AC test measurement I/O waveform Table 11. Input parameters Symbol C Input capacitance (SDA Input capacitance (other pins input impedance WCL ( input impedance WCH Pulse width ...

Page 24

DC and AC parameters Table 13. DC characteristics (M24xxx-W, device grade 3) Symbol Parameter Input leakage current (SCL, SDA E2, E1, E0) I Output leakage current LO I Supply current (Read Supply current (Write) CC0 I ...

Page 25

M24C32-W M24C32-R M24C32-F Table 15. DC characteristics (M24xxx-F) Symbol Input leakage current I LI (SCL, SDA, E2, E1, E0) I Output leakage current LO I Supply current (Read Supply current (Write) CC0 I Standby supply current CC1 Input ...

Page 26

DC and AC parameters Table 16. AC characteristics Symbol Alt SCL t t CHCL HIGH t t CLCH LOW ( QL1QL2 XH1XH2 XL1XL2 DXCX SU:DAT t ...

Page 27

M24C32-W M24C32-R M24C32-F Figure 12. AC waveforms Doc ID 4578 Rev 17 DC and AC parameters 27/38 ...

Page 28

Package mechanical data 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available ...

Page 29

M24C32-W M24C32-R M24C32-F Figure 14. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline A2 1. Drawing is not to scale. Table 18. SO8 narrow – 8 lead plastic small outline, 150 mils body width, ...

Page 30

Package mechanical data Figure 15. TSSOP8 – 8 lead thin shrink small outline, package outline Drawing is not to scale. Table 19. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol ...

Page 31

M24C32-W M24C32-R M24C32-F Figure 16. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 × 3mm, package outline 1. Drawing is not to scale. 2. The central pad (the E2 × D2 area in the ...

Page 32

Part numbering 9 Part numbering Table 21. Ordering information scheme Example: Device type 2 M24 = I C serial access EEPROM Device function C32– Kbit (4096 x 8) Operating voltage 2 5.5 ...

Page 33

M24C32-W M24C32-R M24C32-F Table 22. Available M24C32 products (package, voltage range, temperature grade) Package DIP8 (BN) SO8N (MN) TSSOP8 (DW) MLP8 (MB) M24C32-F M24C32-R 1 5 Grade 6 Grade ...

Page 34

... TSSOP8 (3x3mm² body size) package (MSOP8) removed Table of contents, and Pb-free options added. Minor wording changes in 3.0 Summary Description, Power-On Reset, Memory Addressing, Write Operations, Read Operations. V Absolute Maximum Ratings for V 4.0 Soldering temperature information clarified for RoHS compliant devices. ...

Page 35

... Table 12: DC characteristics (M24xxx-W, device grade CC1 6). 8 Note 1 added to Table 15: DC characteristics (M24xxx-F) modified. UFDFPN8 package specifications updated (see and M24128-BR part numbers added. 9 Generic part number corrected in I corrected in Table 13 CC0 Packages are ECOPACK® compliant. Available packages and temperature ranges by product specified in ...

Page 36

... Section 2.6.4: Power-down conditions Supply voltage ( Updated Figure 4: Maximum R 2 (C) for bus. Replace M24128 and M24C64 by M24128-BFMB6 and M24C64-FMB6, respectively, in Section 4.9: ECC (error correction code) and write cycling. Added temperature grade 6 in F). Updated test conditions for I (M24xxx-W, device grade 12 device grade ...

Page 37

M24C32-W M24C32-R M24C32-F Table 23. Document revision history (continued) Date Revision 05-Jan-2009 07-Dec-2009 I2C modes supported specified in 16 Note removed from Table 15: DC characteristics changes. 64 and 128 Kbit densities removed. ECOPACK status of packages specified Ordering information ...

Page 38

... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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