W25P16VSSIG Winbond Electronics, W25P16VSSIG Datasheet - Page 25

• Manufacturer Part Number: W25P16VSSIG
• Description: IC FLASH 16MBIT 50MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25P16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 50MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25P80 AND W25P16
9.2.14 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 16. The Device ID values for the W25P80 and W25P16 are listed in Manufacturer
and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be
read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read
continuously, alternating from one to the other. The instruction is completed by driving /CS high.
Figure 16. Read Manufacturer / Device ID Diagram
Publication Release Date: January 19, 2007
- 25 -
Revision M